01246nam 2200421 450 991015523080332120171118134639.01-5361-0403-5(CKB)3710000000973798(MiAaPQ)EBC4787083(EXLCZ)99371000000097379820170127h20172017 uy 0engurcnu||||||||rdacontentrdamediardacarrierHearing loss etiology, management and societal implications /Jennifer D. Hughes, editorNew York :Nova Biomedical,2017.©20171 online resource (196 pages) illustrationsOtolaryngology Research Advances1-5361-0391-8 Includes bibliographical references at the end of each chapters and index.Otolaryngology research advances series.Hearing disordersDeafnessHearing disorders.Deafness.617.89Hughes Jennifer D.MiAaPQMiAaPQMiAaPQBOOK9910155230803321Hearing Loss2226591UNINA05435nam 2200661 450 991078970230332120230125185305.01-5231-1759-11-60807-214-2(CKB)2670000000133996(EBL)829302(OCoLC)769344000(SSID)ssj0000593578(PQKBManifestationID)12186399(PQKBTitleCode)TC0000593578(PQKBWorkID)10746558(PQKB)11720477(Au-PeEL)EBL829302(CaPaEBR)ebr10522165(CaBNVSL)mat09100714(IEEE)9100714(MiAaPQ)EBC829302(EXLCZ)99267000000013399620200730d2011 uy engurcn|||||||||txtccrSubstrate Surface Preparation HandbookNorwood :Artech House,2011.[Piscataqay, New Jersey] :IEEE Xplore,[2011]1 online resource (196 p.)Artech House applied photonics seriesDescription based upon print version of record.1-60807-213-4 Includes bibliographical references and index.Substrate SurfacePreparation Handbook; Contents; Foreword; Preface; 1 Introduction; 1.1 Choosing a Process; 1.2 Definitions of Processes Used in This Book; 1.3 Lapping, Grinding, and Polishing Abrasives; 2 Preparation: Before the Start; 2.1 Plates and Measurement; 2.1.1 Plate Measurement; 2.1.2 Maintaining Plate Shape; 2.2 Lapping Plates; 2.2.1 Glazing; 2.3 Polishing Plates; 2.4 Polishing Surfaces: Care and Conditioning; 2.5 Baseplates for Polishing; 2.5.1 Baseplate Materials; 2.6 The Use of Smoothing Blocks; 2.7 Jigs; 2.7.1 When to Use a Jig; 2.7.2 Jig Balance; 2.7.3 Jig Maintenance.2.8 Sample Mounting2.8.1 Vacuum Mounting; 2.8.2 Wax Mounting; 2.8 -- Automated Bonding; 2.8.4 Evaporated Wax Films; 2.8.5 Surface Tension Mounting; 2.8.6 Epoxy Bonding; 2.9 Sample Viewing and Assessment; 2.10 Plate and Sample Flatness Control; 2.10.1 Wafer Distortion; 2.11 Conclusion; References; 3 Lapping; 3.1 The Lapping Process; 3.1.1 If the Stock Removal Is Too Slow; 3.1.2 If the Stock Removal Is Too Fast; 3.2 Plate Shape Monitoring; 3.3 Scratching; 3.4 Smoothing; References; 4 Polishing; 4.1 Introduction; 4.2 Sample Load; 4.3 Abrasives; 4.4 Edge Polishing; 4.5 Slurry Flow Rate.4.6 Grit Sizes4.7 Aligning the Sample; 4.8 The Polishing Run; 4.8.1 Before the Start; 4.8.2 Monitoring Progress; 4.9 Jig Rotation; 4.10 Sample Surface Shape and In-Process Alignment; 4.11 Chemical Polishing; 4.12 Chemomechanical Polishing; 4.13 Fluid Jet Polishing: Future Developments; References; 5 Specific Processes and Materials; 5.1 Geology; 5.2 Hard Materials; 5.2.1 Lapping Hard Materials; 5.2.2 Polishing Hard Materials; 5.3 Water-Soluble Materials; 5.4 Electro-Optic Materials; 5.4.1 Infrared and Electro-Optic Materials; 5.4.2 Processing Infared and Electro-Optic Materials; References.6 Specialized Techniques6.1 Diamond Machining: Introduction; 6.1.1 Diamond Machining of Ductile Materials; 6.1.2 Diamond Machining of Brittle Materials; 6.2 Sawing; 6.2.1 Wire Saws; 6.2.2 High-Speed Saws; 6.2.3 Annular Saws; References; 7 Surface; 7.1 The Lapped Surface Finish; 7.2 Subsurface Damage; 7.3 Understanding Surface Finish; 7.3.1 Cutoff; 7.3.2 Stylus Radius; Reference; 8 Optics; 8.1 Glass; 8.2 Processing with Pitch; 8.3 Pitch Alternatives; 8.4 Spherical Surfaces; 8.5 Blocking Spherical Components; 8.6 Specifying Diamond Tooling; 8.7 Testing of Optical Components; References.9 Semiconductor Device DeconstructionReferences; 10 Metallurgical Polishing and Microscopy; 10.1 Processing; 10.1.1 Process Stages; 10.2 Examination; 10.3 Microscope Setup; References; 11 Laboratory Setup; 11.1 Equipment Locations; 11.2 Laboratory Layout and Dimensions; 11.3 Optimizing the Process Route; 11.4 Sample Cleaning; 11.5 Safety Regulations; 11.6 Lab Environment; 11.7 Consumables; References; 12 Using Interferometry; 12.1 Basic Principles; 12.2 Analysis of Fringe Patterns; 12.3 Normal and Grazing Incidence; 12.4 Introducing the Workshop Interferometer; References; Bibliography.Substrate Surface Preparation serves as a practical, one-stop reference, covering the technologies developed to produce flat surfaces with nanometer accuracy for the subsequent building of semiconductor devices and integrated circuits. This hands-on resource offers you detailed guidance in the entire substrate surface preparation process, from lapping and polishing ... to specialized techniques and surface finishing. Supported with over 125 illustrations, this unique book provides you with a complete understanding of important maintenance methods and the full range of equipment available in the fi.Artech House applied photonics series.Optical materialsSurfacesGlass grinding and polishingOptical materialsSurfaces.Glass grinding and polishing.621.3815671Robertson Max1470840CaBNVSLCaBNVSLCaBNVSLBOOK9910789702303321Substrate Surface Preparation Handbook3682903UNINA03475nam 22005175 450 991025394100332120200702051315.03-319-63037-710.1007/978-3-319-63037-3(CKB)3710000001631549(DE-He213)978-3-319-63037-3(MiAaPQ)EBC5015880(PPN)203853814(EXLCZ)99371000000163154920170831d2017 u| 0engurnn|008mamaatxtrdacontentcrdamediacrrdacarrierEdible Wild Plants: An alternative approach to food security /by Shabnum Shaheen, Mushtaq Ahmad, Nidaa Haroon1st ed. 2017.Cham :Springer International Publishing :Imprint: Springer,2017.1 online resource (XVIII, 183 p. 107 illus. in color.) 3-319-63036-9 Includes bibliographical references.This text focuses on underutilized wild plants that can help to reduce food deficiency in developing nations. Edible wild plants are viewed as a potential solution for overcoming food insecurity for families in these regions, with a specific focus on sustainable production and conservation measures. Detailed analysis of specific wild plants is provided, including the nutritional contents of each plant. A full list of edible wild plants is included for the benefit of researchers, plus a pictorial guide for easy identification of these plants. Specific case studies are provided in which edible wild plants are used to reduce food insecurity, and the diversity of edible wild plants is studied from a global perspective. In developing countries, a significant obstacle to human survival is the increasing gap between food availability and the growing human population. Food insecurity results in less consumption of fruits and vegetables and leads to mineral and vitamin deficiency for individuals in these regions. Edible Wild plants: An alternative approach to food security focuses on growing and using wild plants in order to reduce food insecurity and malnutrition. Wild edible plants are inexpensive and are a rich source of antioxidants, vitamins, fiber, and minerals. As the first book to specifically focus on edible wild plants and their vital role in food security and nutrition, this text is incredibly valuable to any researcher studying innovative potential solutions to food deficiency in the developing world.Plant systematicsPlant taxonomyFood—BiotechnologyPlant Systematics/Taxonomy/Biogeographyhttps://scigraph.springernature.com/ontologies/product-market-codes/L24051Food Sciencehttps://scigraph.springernature.com/ontologies/product-market-codes/C15001Plant systematics.Plant taxonomy.Food—Biotechnology.Plant Systematics/Taxonomy/Biogeography.Food Science.578.012578.09Shaheen Shabnumauthttp://id.loc.gov/vocabulary/relators/aut981297Ahmad Mushtaqauthttp://id.loc.gov/vocabulary/relators/autHaroon Nidaaauthttp://id.loc.gov/vocabulary/relators/autBOOK9910253941003321Edible Wild Plants: An alternative approach to food security2263849UNINA