01320oam 2200385zu 450 991014682850332120241212215315.09781509099283150909928X(CKB)1000000000022613(SSID)ssj0000454405(PQKBManifestationID)12150174(PQKBTitleCode)TC0000454405(PQKBWorkID)10398050(PQKB)11579061(EXLCZ)99100000000002261320160829d2005 uy engtxtccr2005 International Conference on Thermal, Mechanical and Multiphysics Simulation and Experience in Micro-electronics and Micro-systems[Place of publication not identified]I E E E2005Bibliographic Level Mode of Issuance: Monograph9780780390621 0780390628 621.38101/1Ernst L. J1063494Ernst L. J1063494Components, Packaging & Manufacturing Technology Society StaffPQKBPROCEEDING99101468285033212005 International Conference on Thermal, Mechanical and Multiphysics Simulation and Experience in Micro-electronics and Micro-systems2532768UNINA