02133oam 2200541zu 450 991014560600332120210806235837.01-5090-9952-2(CKB)1000000000278225(SSID)ssj0000395918(PQKBManifestationID)12128051(PQKBTitleCode)TC0000395918(PQKBWorkID)10473852(PQKB)11039378(EXLCZ)99100000000027822520160829d2006 uy engtxtccrPolytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings[Place of publication not identified]IEEE2006Bibliographic Level Mode of Issuance: Monograph0-7803-9553-0 Microelectronic packagingMaterialsCongressesPolymersReliabilityCongressesIntegrated circuitsMaterialsCongressesPhotonicsCongressesPolymeric compositesCongressesElectrical & Computer EngineeringHILCCEngineering & Applied SciencesHILCCElectrical EngineeringHILCCMicroelectronic packagingMaterialsPolymersReliabilityIntegrated circuitsMaterialsPhotonicsPolymeric compositesElectrical & Computer EngineeringEngineering & Applied SciencesElectrical Engineering621.381046Institute of Electrical and Electronics EngineersInternational IEEE Conference on Polymers and Adhesives in Microelectronics and PhotonicsPQKBPROCEEDING9910145606003321Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-24, 2005, Hotel Mercure Panorama, Wrocław, Poland : proceedings2522575UNINA