01352oam 2200445zu 450 991014539990332120241212215617.097814244349781424434971(CKB)1000000000710109(SSID)ssj0000453631(PQKBManifestationID)12203621(PQKBTitleCode)TC0000453631(PQKBWorkID)10482888(PQKB)10310406(NjHacI)991000000000710109(EXLCZ)99100000000071010920160829d2008 uy engur|||||||||||txtccr2008 IEEE 9th VLSI Packaging Workshop of Japan[Place of publication not identified]I E E E20081 online resourceBibliographic Level Mode of Issuance: Monograph9781424434985 142443498X Electronic packagingCongressesIntegrated circuitsVery large scale integrationCongressesElectronic packagingIntegrated circuitsVery large scale integration621.381046IEEE StaffPQKBPROCEEDING99101453999033212008 IEEE 9th VLSI Packaging Workshop of Japan2501923UNINA