02846nam 2200625 450 991014129660332120221206095205.01-280-67311-797866136500471-118-16674-41-118-16672-81-118-16675-29786613650047(CKB)2670000000166902(EBL)818509(SSID)ssj0000622811(PQKBManifestationID)11435049(PQKBTitleCode)TC0000622811(PQKBWorkID)10643553(PQKB)10528881(MiAaPQ)EBC818509(CaBNVSL)mat06183551(IDAMS)0b000064817eb439(IEEE)6183551(OCoLC)793103961(EXLCZ)99267000000016690220151221d2012 uy engur|n|---|||||txtccrElectrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC /Er-Ping Li[United States] :IEEE Press ;Hoboken [New Jersey] :Wiley,[Piscataqay, New Jersey] :IEEE Xplore,[2012]1 online resource (390 p.)Description based upon print version of record.0-470-62346-2 Includes bibliographical references and index.Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and Three-dimensional integrated circuitsIntegrated circuitsThree-dimensional integrated circuits.Integrated circuits.621.3015118TEC008050bisacshLi Er-Ping845931CaBNVSLCaBNVSLCaBNVSLBOOK9910141296603321Electrical modeling and design for 3D system integration1888810UNINA