01054nam1 22002771i 450 99000531373040332120181024112611.0000531373FED01000531373(Aleph)000531373FED0100053137319990530d1934----km-y0itay50------baspay-------001yyCatàlogo de la documentación relativa al antiguo reino de Valencia contenida en los registros de la Cancilleria RealArchivio de la Corona de Aragónredactado por Jesùs Ernesto Martfnez FerrandoMadrids.e.19342 v.25 cmCuerpo facultativo de archivios, bibliotecarios y arquelógosMartinez Ferrando,J. ErnestoARCHIVIO DE LA CORONA DE ARAGON397638ITUNINARICAUNIMARCBK990005313730403321FLFBCCatàlogo de la documentación relativa al antiguo reino de Valencia contenida en los registros de la Cancilleria Real1506627UNINA05395nam 2200745 a 450 991013785540332120200520144314.00-470-82840-41-283-20357-X97866132035710-470-82785-80-470-82784-X(CKB)3280000000000176(EBL)818630(OCoLC)746324243(SSID)ssj0000538485(PQKBManifestationID)11324408(PQKBTitleCode)TC0000538485(PQKBWorkID)10560046(PQKB)11019568(MiAaPQ)EBC818630(Au-PeEL)EBL818630(CaPaEBR)ebr10490643(CaONFJC)MIL320357(PPN)243729235(EXLCZ)99328000000000017620110408d2011 uy 0engur|n|---|||||txtccrLED packaging for lighting applications[electronic resource] design, manufacturing, and testing /Sheng Liu, Xiaobing LuoHoboken, N.J. Wiley20111 online resource (376 p.)Description based upon print version of record.0-470-82783-1 Includes bibliographical references and index.LED Packaging for Lighting Applications: Design, Manufacturing and Testing; Contents; Foreword By Magnus George Craford; Foreword By C. P. Wong; Foreword By B. J. Lee; Preface; Acknowledgments; About the Authors; 1 Introduction; 1.1 Historical Evolution of Lighting Technology; 1.2 Development of LEDs; 1.3 Basic Physics of LEDs; 1.3.1 Materials; 1.3.2 Electrical and Optical Properties; 1.3.3 Mechanical and Thermal Properties; 1.4 Industrial Chain of LED; 1.4.1 LED Upstream Industry; 1.4.2 LED Midstream Industry; 1.4.3 LED Downstream Industry; 1.5 Summary; References2 Fundamentals and Development Trends of High Power LED Packaging2.1 Brief Introduction to Electronic Packaging; 2.1.1 About Electronic Packaging and Its Evolution; 2.1.2 Wafer Level Packaging, More than Moore, and SiP; 2.2 LED Chips; 2.2.1 Current Spreading Efficiency; 2.2.2 Internal Quantum Efficiency; 2.2.3 High Light Extraction Efficiency; 2.3 Types and Functions of LED Packaging; 2.3.1 Low Power LED Packaging; 2.3.2 High Power LED Packaging; 2.4 Key Factors and System Design of High Power LED Packaging; 2.5 Development Trends and Roadmap; 2.5.1 Technology Needs; 2.5.2 Packaging Types2.6 SummaryReferences; 3 Optical Design of High Power LED Packaging Module; 3.1 Properties of LED Light; 3.1.1 Light Frequency and Wavelength; 3.1.2 Spectral Distribution; 3.1.3 Flux of Light; 3.1.4 Lumen Efficiency; 3.1.5 Luminous Intensity, Illuminance and Luminance; 3.1.6 Color Temperature, Correlated Color Temperature and Color Rendering Index; 3.1.7 White Light LED; 3.2 Key Components and Packaging Processes for Optical Design; 3.2.1 Chip Types and Bonding Process; 3.2.2 Phosphor Materials and Phosphor Coating Processes; 3.2.3 Lens and Molding Process; 3.3 Light Extraction3.4 Optical Modeling and Simulation3.4.1 Chip Modeling; 3.4.2 Phosphor Modeling; 3.5 Phosphor for White LED Packaging; 3.5.1 Phosphor Location for White LED Packaging; 3.5.2 Phosphor Thickness and Concentration for White LED Packaging; 3.5.3 Phosphor for Spatial Color Distribution; 3.6 Collaborative Design; 3.6.1 Co-design of Surface Micro-Structures of LED Chips and Packages; 3.6.2 Application Specific LED Packages; 3.7 Summary; References; 4 Thermal Management of High Power LED Packaging Module; 4.1 Basic Concepts of Heat Transfer; 4.1.1 Conduction Heat Transfer4.1.2 Convection Heat Transfer4.1.3 Thermal Radiation; 4.1.4 Thermal Resistance; 4.2 Thermal Resistance Analysis of Typical LED Packaging; 4.3 Various LED Packages for Decreasing Thermal Resistance; 4.3.1 Development of LED Packaging; 4.3.2 Thermal Resistance Decrease for LED Packaging; 4.3.3 SiP/COB LED Chip Packaging Process; 4.4 Summary; References; 5 Reliability Engineering of High Power LED Packaging; 5.1 Concept of Design for Reliability (DfR) and Reliability Engineering; 5.1.1 Fundamentals of Reliability; 5.1.2 Life Distribution; 5.1.3 Accelerated Models; 5.1.4 Applied Mechanics5.2 High Power LED Packaging Reliability Test"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--Provided by publisher.Light emitting diodesDesign and constructionLight emitting diodesComputer simulationElectronic packagingElectric lightingEquipment and suppliesLight emitting diodesDesign and construction.Light emitting diodesComputer simulation.Electronic packaging.Electric lightingEquipment and supplies.621.3815/22TEC008010bisacshLiu S(Sheng),1963-995152Luo Xiaobing1974-995153Chemical Industry Press.MiAaPQMiAaPQMiAaPQBOOK9910137855403321LED packaging for lighting applications2279510UNINA