01643nam 2200385 450 991013148380332120230425100552.01-4799-4719-9(CKB)3710000000458248(NjHacI)993710000000458248(EXLCZ)99371000000045824820230425d2014 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrierCloud Computing and Intelligence Systems (CCIS) 2014 IEEE 3rd International Conference on /Huadong MaPiscataway, NJ :IEEE,2014.1 online resource (various pagings) illustrations1-4673-6954-3 1-4799-4720-2 Research and development on cloud computing and intelligent systems have been carried out in last few years and some of them have been successfully deployed and used in many fields This year, the conference aims to address Challenges for cloud computing and intelligent technology The conference will feature a comprehensive technical program including a number of keynote speeches and session discussions.2014 IEEE 3rd International Conference on Cloud Computing and Intelligence SystemsCloud Computing and Intelligence Systems Cloud computingCongressesCloud computing004Ma Huadong853227NjHacINjHaclPROCEEDING9910131483803321Cloud Computing and Intelligence Systems (CCIS)3089089UNINA04462nam 2200673 a 450 991081115300332120240514015012.01-118-00470-11-282-90499-X97866129049980-470-95160-50-470-94997-X1-118-00471-X(CKB)2670000000054590(EBL)698854(OCoLC)689994993(SSID)ssj0000429656(PQKBManifestationID)11965359(PQKBTitleCode)TC0000429656(PQKBWorkID)10430718(PQKB)10208474(MiAaPQ)EBC698854(Au-PeEL)EBL698854(CaPaEBR)ebr10469651(CaONFJC)MIL290499(EXLCZ)99267000000005459020100428d2010 uy 0engur|n|---|||||txtccrThermal design heat sinks, thermoelectrics, heat pipes, compact heat exchangers, and solar cells /HoSung Lee1st ed.Hoboken, N.J. Wiley20101 online resource (650 p.)Description based upon print version of record.0-470-49662-2 Includes bibliographical references and index.Thermal Design; Contents; Preface; 1 Introduction; 2 Heat Sinks; 3 Thermoelectrics; 4 Heat Pipes; 5 Compact Heat Exchangers; 6 Solar Cells; Appendix A Thermophysical Properties; Appendix B Thermoelectrics; Appendix C Pipe Dimensions; Appendix D Curve Fitting of Working Fluids; Appendix E Tutorial I for 2-D; Appendix F Tutorial II for 3-D; Appendix G Computational Work of Heat Pipe; Appendix H Computational Work of a Heat Sink; Appendix I Tutorial for MathCAD; Index"The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics. The proposed book may be used as a capstone design course after the fundamental courses such as thermodynamics, fluid mechanics, and heat transfer. The underlying concepts in this book cover the, 1) understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and 2) designing the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Important design examples are developed using the commercial software, MathCAD, which allows the students to easily reach the graphical solutions even with highly detailed processes. In other words, the design concept is embodied through the example problems. The graphical presentation generally provides designers or students with the rich and flexible solutions toward achieving the optimal design. A solutions manual will be provided"--Provided by publisher."The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics"--Provided by publisher.Heat engineeringMaterialsHeat-transfer mediaThermodynamicsThermoelectric apparatus and appliancesHeat engineeringMaterials.Heat-transfer media.Thermodynamics.Thermoelectric apparatus and appliances.621.402/5Lee HoSung932413MiAaPQMiAaPQMiAaPQBOOK9910811153003321Thermal design2225336UNINA