05810nam 2200721Ia 450 991013086760332120230725053048.01-119-99000-91-283-40520-297866134052031-119-99010-61-119-99009-2(CKB)3460000000003357(EBL)675196(OCoLC)742333202(SSID)ssj0000476989(PQKBManifestationID)11320079(PQKBTitleCode)TC0000476989(PQKBWorkID)10501676(PQKB)10184062(MiAaPQ)EBC675196(Au-PeEL)EBL675196(CaPaEBR)ebr10510634(CaONFJC)MIL340520(EXLCZ)99346000000000335720101207d2011 uy 0engur|n|---|||||txtccrFailure analysis[electronic resource] a practical guide for manufacturers of electronic components and systems /Marius I. Bâzu, Titu-Marius I. BâjenescuChichester, West Sussex, U.K. Wileyc20111 online resource (341 p.)Wiley series in quality & reliability engineeringDescription based upon print version of record.0-470-74824-9 Includes bibliographical references and index.FAILURE ANALYSIS; Contents; Series Editor's Foreword; Foreword by Dr Craig Hillman; Series Editor's Preface; Preface; About the Authors; 1 Introduction; 1.1 The Three Goals of the Book; 1.2 Historical Perspective; 1.2.1 Reliability Prehistory; 1.2.2 The Birth of Reliability as a Discipline; 1.2.3 Historical Development of Reliability; 1.2.4 Tools for Failure Analysis; 1.3 Terminology; 1.4 State of the Art and Future Trends; 1.4.1 Techniques of Failure Analysis; 1.4.2 Failure Mechanisms; 1.4.3 Models for the Physics-of-Failure; 1.4.4 Future Trends; 1.5 General Plan of the Book; References2 Failure Analysis - Why?2.1 Eight Possible Applications; 2.2 Forensic Engineering; 2.2.1 FA at System Level; 2.2.2 FA at Component Level; 2.3 Reliability Modelling; 2.3.1 Economic Benefits of Using Reliability Models; 2.3.2 Reliability of Humans; 2.4 Reverse Engineering; 2.5 Controlling Critical Input Variables; 2.6 Design for Reliability; 2.7 Process Improvement; 2.7.1 Reliability Assurance; 2.8 Saving Money through Early Control; 2.9 A Synergetic Approach; 2.9.1 Synergies of Technological Factors; 2.9.2 Test Structures; 2.9.3 Packaging Reliability2.9.4 Synergies of Operational Stress Factors2.9.5 Synergetic Team; References; 3 Failure Analysis - When?; 3.1 Failure Analysis during the Development Cycle; 3.1.1 Concurrent Engineering; 3.1.2 Failure Analysis during the Design Stage; 3.1.3 Virtual Prototyping; 3.1.4 Reliability Testing during the Development Cycle; 3.2 Failure Analysis during Fabrication Preparation; 3.2.1 Reliability Analysis of Materials; 3.2.2 Degradation Phenomena in Polymers used in Electron Components; 3.3 FA during Fabrication; 3.3.1 Manufacturing History; 3.3.2 Reliability Monitoring; 3.3.3 Wafer-Level Reliability3.3.4 Yield and Reliability3.3.5 Packaging Reliability; 3.3.6 Improving Batch Reliability: Screening and Burn-In; 3.4 FA after Fabrication; 3.4.1 Standard-Based Testing; 3.4.2 Knowledge-Based Testing; 3.5 FA during Operation; 3.5.1 Failure Types during Operation; 3.5.2 Preventive Maintenance of Electronic Systems; References; 4 Failure Analysis - How?; 4.1 Procedures for Failure Analysis; 4.2 Techniques for Decapsulating the Device and for Sample Preparation; 4.2.1 Decapping Techniques; 4.2.2 Decapsulation Techniques; 4.2.3 Cross-Sectioning; 4.2.4 Focused Ion Beam; 4.2.5 Other Techniques4.3 Techniques for Failure Analysis4.3.1 Electrical Techniques; 4.3.2 Optical Microscopy; 4.3.3 Scanning Probe Microscopy (SPM); 4.3.4 Microthermographical Techniques; 4.3.5 Electron Microscopy; 4.3.6 X-Ray Techniques; 4.3.7 Spectroscopic Techniques; 4.3.8 Acoustic Techniques; 4.3.9 Laser Techniques; 4.3.10 Holographic Interferometry; 4.3.11 Emission Microscopy; 4.3.12 Atom Probe; 4.3.13 Neutron Radiography; 4.3.14 Electromagnetic Field Measurements; 4.3.15 Other Techniques; References; 5 Failure Analysis - What?; 5.1 Failure Modes and Mechanisms at Various Process Steps; 5.1.1 Wafer Level5.1.2 PackagingFailure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers neeWiley series in quality and reliability engineering.Electronic apparatus and appliancesReliabilityElectronic systemsTestingSystem failures (Engineering)PreventionElectronic apparatus and appliancesReliability.Electronic systemsTesting.System failures (Engineering)Prevention.621.381TEC032000bisacshBâzu M. I(Marius I.),1948-917706Băjenescu Titu I.1938-479747MiAaPQMiAaPQMiAaPQBOOK9910130867603321Failure analysis2057679UNINA