02012oam 2200457zu 450 991013071860332120241212220415.097814673035141467303518(CKB)3420000000000410(SSID)ssj0000702780(PQKBManifestationID)12261587(PQKBTitleCode)TC0000702780(PQKBWorkID)10686661(PQKB)10983314(NjHacI)993420000000000410(EXLCZ)99342000000000041020160829d2012 uy engur|||||||||||txtccr2012 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference[Place of publication not identified]IEEE20121 online resourceBibliographic Level Mode of Issuance: Monograph9781467303507 146730350X ASMC 2012 proceedings produced by: semi [advertisement] -- Organizing Committee -- Corporate sponsors -- Table of contents -- Identifying systematic critical features using silicon diagnosis data -- Using selective voltage binning to maximize yield -- Analytic modeling of AC response to FET-level elements for CLY optimization -- Optimizing product yield using manufacturing defect weights -- Improving yield learning by electrical fault inspection -- Innovative approach to identify location of AMC source in cleanroom by inverse Computational Fluid Dynamics modeling -- Managing variability within wafertest production by combining lean and six sigma.Process controlCongressesSemiconductor industryManagementProcess controlSemiconductor industryManagement.658.562IEEE StaffPQKBPROCEEDING99101307186033212012 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference2508633UNINA