01111nam0-2200313---450-99000969695040332120130320111029.0000969695FED01000969695(Aleph)000969695FED0100096969520130320d1998----km-y0itay50------baitaITy-------001yyCatalogo delle informazioni sulle località italiane colpite da frane e da inondazioniProgetto AVI - Censimento delle aree storicamente colpite da frane e da inondazionivolume I: franevolume II: inondazioniCardinali M.Cipolla F.PerugiaTipolitografia Grifo19882 v. (XV, 404, 380 p.)ill.23 cmFraneCardinali,M.519346Cipolla,F.188088Guzzetti,F.ITUNINARICAUNIMARCBK99000969695040332115 GT-N/2-39738/739DINIDDINIDCatalogo delle informazioni sulle località italiane colpite da frane e da inondazioni843145UNINA05400nam 22007455 450 991016304630332120251116171202.03-319-44586-310.1007/978-3-319-44586-1(CKB)3710000001041152(DE-He213)978-3-319-44586-1(MiAaPQ)EBC4791270(PPN)198340702(EXLCZ)99371000000104115220170125d2017 u| 0engurnn|008mamaatxtrdacontentcrdamediacrrdacarrier3D Microelectronic Packaging From Fundamentals to Applications /edited by Yan Li, Deepak Goyal1st ed. 2017.Cham :Springer International Publishing :Imprint: Springer,2017.1 online resource (IX, 463 p. 331 illus., 253 illus. in color.) Springer Series in Advanced Microelectronics,1437-0387 ;573-319-44584-7 Includes bibliographical references and index.Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. .This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology.Springer Series in Advanced Microelectronics,1437-0387 ;57ElectronicsMicroelectronicsOptical materialsElectronicsMaterialsElectronic circuitsBiotechnologyNanotechnologyMetalsElectronics and Microelectronics, Instrumentationhttps://scigraph.springernature.com/ontologies/product-market-codes/T24027Optical and Electronic Materialshttps://scigraph.springernature.com/ontologies/product-market-codes/Z12000Electronic Circuits and Deviceshttps://scigraph.springernature.com/ontologies/product-market-codes/P31010Microengineeringhttps://scigraph.springernature.com/ontologies/product-market-codes/C12040Nanotechnology and Microengineeringhttps://scigraph.springernature.com/ontologies/product-market-codes/T18000Metallic Materialshttps://scigraph.springernature.com/ontologies/product-market-codes/Z16000Electronics.Microelectronics.Optical materials.ElectronicsMaterials.Electronic circuits.Biotechnology.Nanotechnology.Metals.Electronics and Microelectronics, Instrumentation.Optical and Electronic Materials.Electronic Circuits and Devices.Microengineering.Nanotechnology and Microengineering.Metallic Materials.621.381Li Yanedthttp://id.loc.gov/vocabulary/relators/edtGoyal Deepakedthttp://id.loc.gov/vocabulary/relators/edtBOOK99101630463033213D Microelectronic Packaging1934663UNINA