00933cam0-22003371i-450-99000057986040332120050513123244.0000057986FED01000057986(Aleph)000057986FED0100005798620020821f19771985km-y0itay50------baitaITa-------001yyEsercizi di scienza delle costruzioniR. Sacca, G. Traini[S.l.]Esa[197-?]v.ill.24 cmScienza delle CostruzioniTeoria delle StruttureCalcolo a RotturaSaccà,R.422612Traini,G.341582ITUNINARICAUNIMARCBK99000057986040332107 A-234 MU.DINSC07 A-229 MU.DINSCDINSCEsercizi di scienza delle costruzioni319205UNINA01772nam 2200385z- 450 9910346703003321202102111000034759(CKB)4920000000094664(oapen)https://directory.doabooks.org/handle/20.500.12854/49267(oapen)doab49267(EXLCZ)99492000000009466420202102d2013 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierHigh Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput MethodKIT Scientific Publishing20131 online resource (XII, 140 p. p.)Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie3-7315-0025-6 In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.Technology: general issuesbicssccantilever bendingdamage structureFatiguethin filmTechnology: general issuesBurger Sofieauth1302194BOOK9910346703003321High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method3026232UNINA