01053nam0 22002773i 450 VAN025029920220915110557.177N978-981-16-1376-020220915d2021 |0itac50 baengSG|||| |||||Semiconductor Advanced PackagingJohn H. LauSingaporeSpringer2021XXII, 498 p.ill.24 cmSGSingaporeVANL000061LauJohn H.VANV204531972648Springer <editore>VANV108073650ITSOL20240614RICAhttps://doi.org/10.1007/978-981-16-1376-0E-book – Accesso al full-text attraverso riconoscimento IP di Ateneo, proxy e/o ShibbolethBIBLIOTECA CENTRO DI SERVIZIO SBAVAN15NVAN0250299BIBLIOTECA CENTRO DI SERVIZIO SBA15CONS SBA EBOOK 9734 15EB 9734 20220915 Semiconductor Advanced Packaging2212364UNICAMPANIA