01291nam0 22003133i 450 VAN024456820220411114129.414N978-981-15-7090-220220411d2021 |0itac50 baengSG|||| |||||3D Microelectronic PackagingFrom Architectures to ApplicationsYan Li, Deepak Goyal editorsSecond EditionSingaporeSpringer2021XVI, 477 p.ill.24 cm001VAN00631312001 Springer series in advanced microelectronics210 Berlin [etc.]Springer64SGSingaporeVANL000061GoyalDeepakVANV199737LiYanVANV097602Springer <editore>VANV108073650ITSOL20240614RICAhttps://link.springer.com/book/10.1007/978-981-15-7090-2E-book – Accesso al full-text attraverso riconoscimento IP di Ateneo, proxy e/o ShibbolethBIBLIOTECA CENTRO DI SERVIZIO SBAVAN15NVAN0244568BIBLIOTECA CENTRO DI SERVIZIO SBA15CONS SBA EBOOK 8846 15EB 8846 20220411 3D Microelectronic Packaging1934663UNICAMPANIA