05050nam 2200613Ia 450 991014439320332120170809161013.01-282-02166-497866120216643-527-62645-X3-527-62646-8(CKB)1000000000687158(EBL)482038(OCoLC)317508876(SSID)ssj0000104645(PQKBManifestationID)11117057(PQKBTitleCode)TC0000104645(PQKBWorkID)10085172(PQKB)10604807(MiAaPQ)EBC482038(EXLCZ)99100000000068715820080930d2009 uy 0engur|n|---|||||txtccrApplied adhesive bonding[electronic resource] a practical guide for flawless results /Gerd Habenicht ; translated by Christine AhnerWeinheim ;Chichester Wiley-VCHc20091 online resource (188 p.)Includes bibliographical references (p. 145-147) and index.3-527-32014-8 Applied Adhesive Bonding; Contents; Preface; 1 Introduction; 1.1 Bonding as a Joining Process; 1.2 Advantages and Disadvantages of Bonding; 1.3 Terms and Definitions; 2 Structure and Classification of Adhesives; 2.1 Structure of Adhesives; 2.1.1 Carbon as Central Element; 2.1.2 Monomer - Polymer; 2.1.3 Polymer Formation; 2.2 Classification of Adhesives; 2.2.1 Adhesives Curing by Chemical Reaction (Reactive Adhesives); 2.2.2 Adhesives Curing without Chemical Reaction (Physically Setting Adhesives); 2.2.3 Solvent-Containing and Solvent-Free Adhesives2.2.4 Adhesives on Natural and Synthetic Basis2.2.5 Adhesives on Organic and Inorganic Basis; 2.2.6 Application-Related Names of Adhesives; 3 From Adhesive to Adhesive Layer; 3.1 Reactive Adhesives - Fundamentals; 3.1.1 Pot Life; 3.1.2 Mixing Ratio of the Components; 3.1.3 Impact of Time on Adhesive Curing; 3.1.4 Impact of Temperature on Adhesive Curing; 3.2 Two-Component and One-Component Reactive Adhesives; 3.2.1 Two-Component Reactive Adhesives; 3.2.2 One-Component Reactive Adhesives; 3.3 Properties of Adhesive Layers; 3.3.1 Thermoplastics; 3.3.2 Thermoset Plastics; 3.3.3 Elastomers3.3.4 Glass Transition Temperature3.3.5 Creep; 4 Important Reactive Adhesives; 4.1 Epoxy Resin Adhesives; 4.1.1 Two Component Epoxy Resin Adhesives; 4.1.2 One-Component Epoxy Resin Adhesives; 4.1.3 Reactive Epoxy Resin Hot-Melt Adhesives; 4.1.4 Properties and Application of Epoxy Resin Adhesives; 4.2 Polyurethane (PUR) Adhesives; 4.2.1 Two-Component Polyurethane Adhesives (Solvent-Free); 4.2.2 One-Component Polyurethane Adhesives (Solvent-Free); 4.2.3 Reactive Polyurethane Hot-Melt Adhesives (Solvent-Free); 4.2.4 One-Component Polyurethane Solvent-Based Adhesives4.2.5 Two-Component Polyurethane Solvent-Based Adhesives4.2.6 Polyurethane Dispersion Adhesives; 4.3 Acrylic Adhesives; 4.3.1 Cyanoacrylate Adhesives; 4.3.2 Radiation-Curing Adhesives; 4.3.3 Methacrylate Adhesives; 4.3.4 Anaerobic Adhesives; 4.4 Unsaturated Polyester Resins (UP-Resins); 4.5 Phenolic Adhesives; 4.6 Silicones; 4.7 Summary Reactive Adhesives; 4.8 Film Adhesives; 4.9 Sealing Materials; 4.10 Polymer Mortars; 5 Physically Setting Adhesives; 5.1 Hot-Melt Adhesives; 5.2 Solvent-Based Adhesives; 5.3 Contact Adhesives; 5.4 Dispersion Adhesives; 5.5 Plastisols5.6 Pressure-Sensitive Adhesives, Adhesive Tapes5.7 Adhesive Strips; 5.8 Glue Sticks; 5.9 Adhesives Based on Natural Raw Materials; 5.10 Adhesives on an Inorganic Basis; 6 Adhesive Forces in Bonded Joints; 6.1 Adhesive Forces Between Adhesive Layer and Adherend (Adhesion); 6.2 Wetting; 6.3 Surface Tension; 6.4 Adhesive Forces Inside an Adhesive Layer (Cohesion); 7 Production of Bonded Joints; 7.1 Surface Treatment; 7.1.1 Surface Preparation; 7.1.1.1 Cleaning; 7.1.1.2 Adjusting; 7.1.1.3 Degreasing; 7.1.1.4 Degreasing Agents; 7.1.2 Surface Pretreatment; 7.1.2.1 Mechanical Surface Pretreatment7.1.2.2 Physical and Chemical Surface PretreatmentThis manual provides the most important information on successful bonding. Various practical advices and helpful tips are useful for the handling of adhesives. Due to its didactically structured content, the book may also serve as a medium for training courses in bonding engineering. The basics of this innovative joining procedure are described in a practical and easily understandable way suitable for the application in trade and industry.AdhesivesBinders (Materials)Electronic books.Adhesives.Binders (Materials)668.3Habenicht Gerd911726Ahner Christine897430MiAaPQMiAaPQMiAaPQBOOK9910144393203321Applied adhesive bonding2041689UNINA02045nam0 22004933i 450 VAN017780220230616091400.896N978940076892520210708d2016 |0itac50 baengNL|||| |||||Handbook of SpintronicsYongbing Xu, David D. Awschalom, Junsaku Nitta editorsDordrechtSpringer2016xxiv, 1602 p.ill.24 cmVAN0177803Handbook of Spintronics182061681-XXQuantum theory [MSC 2020]VANC019967MF80-XXClassical thermodynamics, heat transfer [MSC 2020]VANC022357MF74-XXMechanics of deformable solids [MSC 2020]VANC022466MF00A79 (77-XX)Physics [MSC 2020]VANC023182MF92ExxChemistry [MSC 2020]VANC025596MFCanopusKW:KMagnetic nanostructuresKW:KMagneto electronicsKW:KQuantum electronicsKW:KReference on spintronicsKW:KSemiconductor spintronicsKW:KSpin electronicsKW:KSpin functional devicesKW:KSpin-electronic devicesKW:KSpintronicsKW:KNLDordrechtVANL000068AwschalomDavid D.VANV160073NittaJunsakuVANV160074XuYongbingVANV160072Springer <editore>VANV108073650ITSOL20240614RICAhttp://doi.org/10.1007/978-94-007-6892-5E-book – Accesso al full-text attraverso riconoscimento IP di Ateneo, proxy e/o ShibbolethBIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICAIT-CE0120VAN08NVAN0177802BIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICA08CONS e-book 2950 08eMF2950 20210708 Handbook of Spintronics1820616UNICAMPANIA