02602nam0 22005173i 450 VAN0028578120250401090703.268N978981199267420250129d2023 |0itac50 baengSG|||| |||||i e bcrProceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2022, 14-15 September, Langkawi, MalaysiaMohd Arif Anuar Mohd Salleh ... [et al.] editorsSingaporeSpringer2023xli, 875 p.ill.24 cm001VAN001327472001 Springer Proceedings in Physics210 Berlin [etc.]Springer1984-28900A79 (77-XX)Physics [MSC 2020]VANC023182MF91-XXGame theory, economics, finance, and other social and behavioral sciences [MSC 2020]VANC025601MF91B76Environmental economics (natural resource models, harvesting, pollution, etc.) [MSC 2020]VANC030910MFAdvanced MaterialsKW:KAutomotive electronicsKW:KInterconnect materialsKW:KNon-solder interconnect materialsKW:KPb-free soldersKW:KPower electronicsKW:KSurface coating materialsKW:KSGSingaporeVANL000061SallehMohd A. A.VANV215741340Green Materials and Electronic Packaging Interconnect Technology Symposium2022Langkawi, MalaysiaVANV2397311783255Springer <editore>VANV108073650Mohd Arif Anuar, Mohd SallehSalleh, Mohd A. A.VANV215742Salleh, M.A.A.M.Salleh, Mohd A. A.VANV215743Salleh, M. A. A. M.Salleh, Mohd A. A.VANV215744Salleh, Mohd Arif AnuarSalleh, Mohd A. A.VANV236985Salleh, Mohd A.A.Salleh, Mohd A. A.VANV236986ITSOL20250404RICAhttps://doi.org/10.1007/978-981-19-9267-4E-book – Accesso al full-text attraverso riconoscimento IP di Ateneo, proxy e/o ShibbolethBIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICAIT-CE0120VAN08NVAN00285781BIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICA08DLOAD e-Book 10469 08eMF10469 20250212 Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium4310580UNICAMPANIA