02279nam0 22005533i 450 VAN0026877620250627114857.697N978146139555320231214d1985 |0itac50 baengUS|||| |||||Heat Conduction Within Linear ThermoelasticityWilliam Alan DayNew YorkSpringer1985viii, 82 p.23 cm001VAN000484302001 Springer tracts in natural philosophy210 Berlin [etc.]Springer3035K05Heat equation [MSC 2020]VANC020092MF35K55Nonlinear parabolic equations [MSC 2020]VANC022799MF74-XXMechanics of deformable solids [MSC 2020]VANC022466MF74A15Thermodynamics in solid mechanics [MSC 2020]VANC023449MF74F05Thermal effects in solid mechanics [MSC 2020]VANC023448MFDevelopmentKW:KDifferential equationsKW:KElasticityKW:KEntropyKW:KGrowthKW:KHeatKW:KInfluenceKW:KIntegralsKW:KMaximumKW:KMinimumKW:KPartial Differential EquationsKW:KSolutionsKW:KTemperatureKW:KUSNew YorkVANL000011BerlinVANL000066DayWilliam A.VANV04316340528Springer <editore>VANV108073650Day, William AlanDay, William A.VANV061662Day, W.A.Day, William A.VANV061663Day, W. A.Day, William A.VANV061664ITSOL20250704RICAhttps://doi.org/10.1007/978-1-4613-9555-3E-book – Accesso al full-text attraverso riconoscimento IP di Ateneo, proxy e/o ShibbolethBIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICAIT-CE0120VAN08NVAN00268776BIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICA08DLOAD e-book 7715 08eMF7715 20231218 Heat conduction within linear thermoelasticity1425071UNICAMPANIA