01081nam0 2200289 i 450 SUN010830620170306114917.3648-1-4939-1555-20.00N978-1-4939-1556-920170306d2015 |0engc50 baengUS|||| |||||*Wafer-Level Chip-Scale PackagingAnalog and Power Semiconductor Applications Shichun Qu, Yong LiuNew York : Springer, 2015xvii322 p. ; 24 cmPubblicazione in formato elettronicoUSNew YorkSUNL000011Qu, ShichunSUNV083634720835Liu, YongSUNV083635720834SpringerSUNV000178650ITSOL20200921RICAhttps://link.springer.com/book/10.1007%2F978-1-4939-1556-9SUN0108306BIBLIOTECA CENTRO DI SERVIZIO SBA15CONS SBA EBOOK 722 15EB 722 20170306 Wafer-Level Chip-Scale Packaging1412832UNICAMPANIA