01578nam2 2200289 i 450 SUN006396920141013110850.85503-00-03173-40.0020080416d1985 |0itac50 baitaIT|||| |||||ˆ<<‰Alessandro Algardi>> 2Jennifer MontaguNew HavenLondonpublished in association with the J. Paul Getty Trust by Yale university1985IX, 305-487 p., 96 c. di tav.28 cm.001SUN00639672001 Alessandro AlgardiJennifer Montagu2210 New HavenLondonpublished in association with the J. Paul Getty Trust by Yale university215 volumi29 cm.USNew HavenSUNL000040Montagu, JenniferSUNV019646153191Yale universitySUNV000131650ITSOL20181109RICASUN0063969UFFICIO DI BIBLIOTECA DEL DIPARTIMENTO DI LETTERE E BENI CULTURALI07 CONS Pa Algardi 1482 II 07 71366 UFFICIO DI BIBLIOTECA DEL DIPARTIMENTO DI LETTERE E BENI CULTURALI07 CONS Pa Algardi IIa 07 93578 UFFICIO DI BIBLIOTECA DEL DIPARTIMENTO DI LETTERE E BENI CULTURALIIT-CE010371366CONS Pa Algardi 1482 IIcaUFFICIO DI BIBLIOTECA DEL DIPARTIMENTO DI LETTERE E BENI CULTURALIIT-CE010393578CONS Pa Algardi IIacaAlessandro Algardi 21436838UNICAMPANIA01391nam 2200373 450 99657461330331620230824224534.01-7281-4870-7(CKB)5280000000207669(NjHacI)995280000000207669(EXLCZ)99528000000020766920230418d2019 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2019 International 3D Systems Integration Conference (3DIC 2019) October 8-10, 2019, Sendai, Japan /Institute of Electrical and Electronics Engineers[Piscataway, New Jersey] :Institute of Electrical and Electronics Engineers,2019.1 online resource (various pagings) illustrations1-7281-4871-5 Integrated circuitsDesign and constructionCongressesThree-dimensional imagingCongressesThree-dimensional integrated circuitsCongressesIntegrated circuitsDesign and constructionThree-dimensional imagingThree-dimensional integrated circuits515.43NjHacINjHaclPROCEEDING9965746133033162019 International 3D Systems Integration Conference (3DIC 2019)3433028UNISA