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1. |
Record Nr. |
UNISA996559972603316 |
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Titolo |
63055-2023 - IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design / / IEEE |
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Pubbl/distr/stampa |
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New York, USA : , : IEEE, , 2023 |
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ISBN |
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Descrizione fisica |
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1 online resource (298 pages) |
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Disciplina |
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Soggetti |
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Printed circuits - Design and construction |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Sommario/riassunto |
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A method is provided for specifying a common interoperable format for electronic systems design. The format provides a common way to specify information-data about the project management, netlists, components, design rules, and geometries used in the large-scale integration-package-board designs. The method provides the ability to make electronic systems a key consideration early in the design process; design tools can use it to seamlessly exchange information-data. |
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2. |
Record Nr. |
UNISA996574614403316 |
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Titolo |
2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS) / / Institute of Electrical and Electronics Engineers (IEEE) |
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Pubbl/distr/stampa |
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Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers (IEEE), , 2019 |
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ISBN |
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Descrizione fisica |
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1 online resource (various pagings) : illustrations |
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Disciplina |
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Soggetti |
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Bipolar integrated circuits |
Bipolar transistors |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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