Electronic systems and intelligent computing : proceedings of ESIC 2020 / / Pradeep Kumar Mallick [and three others] editors

• Record Nr.: UNISA996465468703316
• Pubbl/distr/stampa: Singapore : , : Springer, , [2020]; ©2020
• ISBN: 981-15-7031-0
• Edizione: [1st ed. 2020.]
• Descrizione fisica: 1 online resource (XXVI, 1154 p. 690 illus., 495 illus. in color.)
• Collana: Lecture Notes in Electrical Engineering ; ; Volume 686
• Disciplina: 006.3
• Soggetti: Artificial intelligence; Computer networks
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Nota di contenuto: A Reliable and Secure Wireless Network for VoIP Application -- Interdisciplinary Approaches Incorporating Computational Intelligence in Modern Pharmacognosy to Address Biological Problems -- Solar Power Plant Site Selection: A Systematic Literature Review on MCDM Techniques Used -- Biometrics Based Pig Identification: From Invention to Commercialisation -- Optimal Placement of FACTS Devices in the Power System Using ANN to Increase the System Loadability -- Impact of Noise Levels on SVM-GMM based Speaker Recognition System -- Implementation of Perturbation Based MPPT Technique Using Model Based Design -- Modified Aggressive Packet Combining Scheme with Repetition Code for Throughput Enhancement in High Error Rate Channel -- Development of Image Based Disease Scale of Phoma Blight of Potato using K-means Clustering.
• Sommario/riassunto: This book presents selected, high-quality research papers from the International Conference on Electronic Systems and Intelligent Computing (ESIC 2020), held at NIT Yupia, Arunachal Pradesh, India, on 2 – 4 March 2020. Discussing the latest challenges and solutions in the field of smart computing, cyber-physical systems and intelligent technologies, it includes papers based on original theoretical, practical and experimental simulations, developments, applications, measurements, and testing. The applications and solutions featured ; provide valuable reference material for future product development. .