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1. |
Record Nr. |
UNISA996395829703316 |
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Autore |
Carpenter Richard <d. 1670?> |
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Titolo |
The downfall of Anti-Christ. Or, A treatise wherein is plainly discovered [[electronic resource] ] : 1. That the Pope is Anti-Christ, and that Rome is Babylon. 2. The severall deceitfull workings, and enticing means that the Babilonish whore hath used to intoxicate the kingdoms of the earth with the wine of her fornication, ... 3. Probable conjectures that the Anti-Christian party have seene their best dayes, and that the Popish religion, and all the power of Rome shal more & more decay throughout al [sic] the churches of Europe, ... 4. That the destruction, and extirpation of Anti-Christ shall make way for the setting up the kingdom of our Lord Jesus Christ in its glory and beauty, which alone is that which maketh a people or a nation truly happy-By R.C. An unworthy admirer of these things |
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Pubbl/distr/stampa |
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Printed at London, : for John Stafford, 1647 |
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Descrizione fisica |
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Soggetti |
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Anti-Catholicism - England |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Dedication signed: Richard Carpenter. |
"The third booke" begins new pagination. |
Errata: p. [336]. |
Reproduction of original in Dr. Williams' Library, London, England. |
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Sommario/riassunto |
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2. |
Record Nr. |
UNINA9911020335303321 |
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Autore |
Li Er-Ping |
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Titolo |
Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / / Er-Ping Li |
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Pubbl/distr/stampa |
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Hoboken, N.J., : Wiley, c2012 |
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ISBN |
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9786613650047 |
9781280673115 |
1280673117 |
9781118166741 |
1118166744 |
9781118166727 |
1118166728 |
9781118166758 |
1118166752 |
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Descrizione fisica |
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1 online resource (390 p.) |
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Classificazione |
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Disciplina |
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Soggetti |
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Three-dimensional integrated circuits |
Integrated circuits |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
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Sommario/riassunto |
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New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the |
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state of the technology in electronic package integration and printed circuit board simulation and |
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