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Record Nr. |
UNISA996279482803316 |
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Titolo |
2016 International Conference on Electronics Packaging (ICEP) : 20-22 April 2016, Hokkaido, Japan / / Institute of Electrical and Electronics Engineers |
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Pubbl/distr/stampa |
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Piscataway, New Jersey : , : IEEE, , [2016] |
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©2016 |
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ISBN |
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Descrizione fisica |
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1 online resource (692 pages) : illustrations |
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Disciplina |
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Soggetti |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Sommario/riassunto |
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ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling simulation, and applications. |
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