Les douanes de Genes 1376-1377 : John Day

• Record Nr.: UNISA990002147720203316
• Autore: DAY, John
• Pubbl/distr/stampa: Paris : S.E.V.P.E.N., 1963
• Descrizione fisica: 2 v. ; 24 cm
• Collana: Ecole pratique des hautes études/Ports Routes Trafics ; 17
• Collocazione: XXX.B. Coll. 119/ 14 1 (Collez. MS 17/I); XXX.B. Coll. 119/ 14 2 (Collez. MS 17/II)
• Lingua di pubblicazione: Francese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia

Silicon nanomembranes : fundamental science and applications / / edited by John A. Rogers and Jong-Hyun Ahn

• Record Nr.: UNINA9910831075903321
• Pubbl/distr/stampa: Weinheim, Germany : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2016; ©2016
• ISBN: 3-527-69100-6; 3-527-69099-9
• Descrizione fisica: 1 online resource (369 p.)
• Disciplina: 660.2842
• Soggetti: Membranes (Technology); Nanosilicon
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references at the end of each chapters and index.
• Nota di contenuto: Cover; Title Page; Copyright; Contents; List of Contributors; Part 1 Materials and Processes; Chapter 1 Synthesis, Assembly, and ; Applications of Semiconductor Nanomembranes; 1.1 Introduction; 1.2 Strategies for Forming Silicon Nanomembranes; 1.2.1 Selective Etching to Release Nanomembranes from Layered Assemblies; 1.2.2 Anisotropic Etching to Release Silicon Nanomembranes from Bulk Silicon Wafers; 1.3 Transfer Printing for Deterministic Assembly; 1.3.1 Introduction; 1.3.2 Mechanics of Transfer Printing; 1.3.3 Transfer Printing for Single- and Multilayer Deterministic Assembly; 1.4 Compressive Buckling for Deterministic Assembly1.4.1 Introduction; 1.4.2 Buckling on Compliant Substrates for Wavy Layouts; 1.4.3 Patterned Adhesion for Controlled, Large-Scale Buckling; 1.4.4 Deterministic Assembly of Complex, Three-Dimensional Architectures by Compressive Buckling; 1.5 Functional Devices Made from Silicon Nanomembranes; 1.5.1 Physically Transient Electronics; 1.5.2 Injectable, Cellular-Scale Optoelectronic Devices for the Brain; 1.5.3 Three-Dimensional Integumentary Membranes for Spatiotemporal Cardiac Measurements; 1.5.4 Arthropod Eyes Inspired Digital Camera; 1.5.5 Cephalopod Skins Inspired Optoelectronic Camouflage Systems1.6 Conclusions and Outlook; References; Chapter 2 Models of Reactive Diffusion for Resorbable Electronics; 2.1 Introduction; 2.2 Hydrolysis of Silicon Nanomembranes; 2.3 Material-Level Dissolution; 2.4 Dissolution of Device with Layered Structures; 2.5 Discussion and Conclusion; Acknowledgments; References; Part 2 Applications in Bio-Integrated and Flexible Electronics; Chapter 3 Transparent and Foldable Electronics Enabled by Si Nanomembranes; 3.1 Introduction; 3.2 Fabrication; 3.3 Characterization; 3.3.1 Mechanical Properties of Si NM in Bending and Stretching3.3.2 Optical Properties; 3.3.3 Piezoresistive Effect in Si NM; 3.4 Configurations of Transparent and Foldable Electronic Devices; 3.4.1 Representative Materials for Transparent and Foldable Electronics; 3.4.2 Electrical and Optical Properties of Transparent TFTs; 3.4.3 Modification of the Bending Stiffness with Substrate Thickness; 3.4.4 Electromechanical Properties of Foldable TFTs; 3.4.5 Control of Stiffness by Thinning of Si for Stretchable Electronic Devices; 3.4.6 Control of Strain Distribution by Geometrical Design; 3.4.7 Mechanical Properties of Stretchable Inverters3.5 Concluding Remarks; References; Chapter 4 High-Performance Flexible Electronic and Optoelectronic Devices by Mechanical Exfoliation from a Brittle Substrate; 4.1 Introduction; 4.2 Steady-State Substrate Cracking Parallel to the Interface in a Bilayers; 4.3 Spalling-Mode Fracture for Layer Transfer; 4.4 High-Performance Flexible Electronics by Controlled Spalling; 4.4.1 Ultra-Low-Power Nanoscale Silicon Integrated Circuits on Plastic; 4.4.2 Electrical Characteristics of Flexible Devices and Circuits; 4.4.3 Effect of Strain on Device Performance