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Record Nr. |
UNINA9911015970103321 |
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Autore |
Gan Chong Leong |
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Titolo |
Electronic Materials Innovations and Reliability in Advanced Memory Packaging / / by Chong Leong Gan, Chen Yu Huang |
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Pubbl/distr/stampa |
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Cham : , : Springer Nature Switzerland : , : Imprint : Springer, , 2025 |
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ISBN |
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Edizione |
[1st ed. 2025.] |
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Descrizione fisica |
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1 online resource (278 pages) |
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Collana |
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Springer Series in Reliability Engineering, , 2196-999X |
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Altri autori (Persone) |
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Disciplina |
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Soggetti |
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Electronics - Materials |
Electronic circuits |
Electronic circuit design |
Materials |
Industrial engineering |
Production engineering |
Electronic Materials |
Electronic Circuits and Systems |
Electronics Design and Verification |
Materials Engineering |
Industrial and Production Engineering |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Nota di contenuto |
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Influences of Electronic Materials Properties on Packaging Reliability -- Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging -- Materials Development for Future Data Center Applications -- Advanced Chiplets and Heterogenous Integration in Memory Device Packaging -- Hybrid Bonding Device Packaging -- Hardware Reliability for Memory Modules and SSDs -- Innovative Sustainable Electronics Materials in Advanced Memory Packaging -- PCB and Substrate in Future Memory Applications. |
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Sommario/riassunto |
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This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are |
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