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Record Nr. |
UNINA9911007368603321 |
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Titolo |
Handbook of silicon wafer cleaning technology / / edited by Karen A. Reinhardt, Werner Kern |
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Pubbl/distr/stampa |
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Norwich, NY, : William Andrew, c2008 |
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ISBN |
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1-282-76970-7 |
0-08-094746-8 |
9786612769702 |
1-282-00282-1 |
9786612002823 |
0-8155-1773-4 |
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Edizione |
[2nd ed.] |
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Descrizione fisica |
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1 online resource (749 p.) |
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Collana |
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Materials science & process technology series |
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Altri autori (Persone) |
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ReinhardtKaren A |
KernWerner <1925-> |
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Disciplina |
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Soggetti |
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Silicon-on-insulator technology |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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Front Cover; Handbook of Silicon Wafer Cleaning Technology; Copyright Page; Contents; Foreword; Preface to the Second Edition; Preface to First Edition; PART I: INTRODUCTION AND OVERVIEW; Chapter 1. Overview and Evolution of Silicon Wafer Cleaning Technology; 1.1 Introduction; 1.2 Importance of Clean and Conditioned Wafer Surfaces; 1.3 Overview of Wafer Contamination Aspects; 1.4 Overview of Wafer Cleaning and Surface Conditioning Technology; 1.5 Evolution of Wafer Cleaning Science and Technology; 1.6 Summary and Conclusion; References |
Chapter 2. Overview of Wafer Contamination and Defectivity2.1 Wafer Contamination; 2.2 Behavior and Impact of Contamination; 2.3 Sources of Defects and Contamination; References; PART II: WET CHEMICAL PROCESS; Chapter 3. Particle Deposition and Adhesion; 3.1 Introduction to Particle Deposition and Adhesion; 3.2 Particle Transport, Deposition, and Adhesion; 3.3 Particle Adhesion; 3.4 Particle Removal; 3.5 Summary; References; Chapter 4. Aqueous Cleaning and Surface Conditioning Processes; 4.1 Overview of Aqueous Cleaning, Rinsing, |
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and Drying Applications and Techniques |
4.2 Common Chemistries and Their Applications4.3 Process Variables Affecting Cleaning; 4.4. Rinsing and Drying; 4.5 Aqueous Cleaning Equipment; 4.6 Current and Future Challenges; 4.7 Summary; Acknowledgments; References; PART III: DRY CLEANING PROCESSES; Chapter 5. Gas-phase Wafer Cleaning Technology; 5.1 Introduction and Overview of Gas-Phase and Vapor-Phase Cleaning and Surface Conditioning; 5.2 Chemistry and Mechanisms; 5.3 Removal of Silicon Oxides with HF Vapor; 5.4 O3 and UV/O3 for Organic Removal, Resist Stripping, and Surface Oxidation; 5.5 UV/Cl2 for Metallic Contamination Removal |
5.6 Applications for Gas-Phase Cleaning5.7 Process Equipment; 5.8 Integrated Process Equipment; 5.9 Summary; Acknowledgments; References; Chapter 6. Plasma Stripping, Cleaning, and Surface Conditioning; 6.1 Introduction to Plasma Stripping and Cleaning; 6.2 Applications of Plasma Stripping, Cleaning, and Surface Conditioning; 6.3 Mechanisms of Plasma Stripping, Cleaning, and Surface Conditioning; 6.4 Plasma Stripping, Cleaning, and Surface Conditioning Equipment; 6.5 Plasma Diagnostics; 6.6 Plasma Damage; 6.7 Conclusions; Acknowledgments; References |
Chapter 7. Cryogenic Aerosols and Supercritical Fluid Cleaning7.1 Cryogenic and Supercritical Cleaning as Emerging Technologies; 7.2 Introduction to Cryogenic Aerosols; 7.3 Introduction to Supercritical and Densified Fluid Cleaning; 7.4 Summary; Acknowledgments; References; PART IV: ANALYTICAL AND CONTROL ASPECTS; Chapter 8. Detection and Measurement of Particulate Contaminants; 8.1 Measurements of Particle and Defects; 8.2 Defect and Particle Measurements on Wafers; 8.3 Particle Measurement in Liquid Chemicals; 8.4 Particle Measurement in Vacuum, Gas, and Air; Acknowledgements; References |
Chapter 9. Surface Chemical Composition and Morphology |
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Sommario/riassunto |
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The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and t |
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