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1. |
Record Nr. |
UNINA9910971236403321 |
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Autore |
van Nunspeet Félice |
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Titolo |
Alarmbellen in Het Brein? : De Invloed Van Sociale Normen Op Het Belang Van Regelnaleving en Op de Cognitieve Processen Onderliggend Aan Regelnalevend en -Overtredend Gedrag |
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Pubbl/distr/stampa |
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The Hague : , : Boom Uitgevers Den Haag, , 2021 |
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©2021 |
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ISBN |
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Edizione |
[1st ed.] |
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Descrizione fisica |
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1 online resource (90 pages) |
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Altri autori (Persone) |
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Soggetti |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Sommario/riassunto |
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This book explores the influence of social norms on the importance of rule compliance and the cognitive processes involved in compliant and transgressive behaviors. Authored by Dr. Félice van Nunspeet and Prof. Dr. Naomi Ellemers, it documents findings from three studies that show how social norms impact individuals' perceptions of rule importance and cognitive processing during compliance or transgression. The research highlights the significance of understanding social norms in shaping behavior, particularly in demanding situations, and the implications for the effectiveness of regulatory enforcement. The work aims to contribute to the body of knowledge on the mechanisms underlying rule compliance and offers insights into how governmental bodies can influence such behaviors. It is intended for scholars, policymakers, and practitioners interested in regulation, compliance, and social psychology. |
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2. |
Record Nr. |
UNINA9910299841503321 |
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Autore |
Fischer-Hirchert Ulrich H. P |
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Titolo |
Photonic Packaging Sourcebook : Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules / / by Ulrich H. P. Fischer-Hirchert |
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Pubbl/distr/stampa |
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Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2015 |
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ISBN |
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Edizione |
[1st ed. 2015.] |
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Descrizione fisica |
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1 online resource (336 p.) |
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Disciplina |
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Soggetti |
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Microwaves |
Optical engineering |
Nanotechnology |
Electronic circuits |
Microwaves, RF and Optical Engineering |
Nanotechnology and Microengineering |
Circuits and Systems |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references at the end of each chapters and index. |
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Nota di contenuto |
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Introduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index. |
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Sommario/riassunto |
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This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also |
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assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects. |
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