1.

Record Nr.

UNINA9910877401703321

Titolo

Microengineering of metals and ceramics . Part I Design, tooling and injection molding / / volume editors, Detlef Lohe and Jurgen Haubelt

Pubbl/distr/stampa

Weinheim, : Wiley-VCH, c2005

ISBN

1-281-84298-2

9786611842987

3-527-61672-1

3-527-61694-2

Descrizione fisica

1 online resource (394 p.)

Collana

Advanced micro & nanosystems ; ; v. 3

Altri autori (Persone)

LoheDetlef

HausseltJurgen

Disciplina

620.14

Soggetti

Micromechanics

Ceramic materials - Microstructure

Metals - Microstructure

Microtechnology

Injection molding of ceramics

Injection molding of metals

Lingua di pubblicazione

Inglese

Formato

Materiale a stampa

Livello bibliografico

Monografia

Note generali

Description based upon print version of record.

Nota di bibliografia

Includes bibliographical references and indexes.

Nota di contenuto

Advanced Micro & Nanosystems Volume 3 Microengineering of Metals and Ceramics; Preface; Foreword; Contents; List of Contributors; Subject Index; I Design; 1 Design Environment and Design Flow; 2 Modeling and Validation in Design; 3 Modeling Micro PIM; II Tooling; 4 Strategies for the Manufacture of Mold Inserts; 5 Micro End Milling of Hardened Steel; 6 3D Microstructuring of Mold Inserts by Laser-based Removal; 7 Micro-EDM for Mold Inserts; 8 Lithographic Fabrication of Mold Inserts; 9 Material States and Surface Conditioning for Mold Inserts

III Replication Techniques - Microinjection Molding10 Microinjection Molding - Principles and Challenges; 11 Micro Metal Injection Molding; 12 Micro Ceramic Injection Molding

Sommario/riassunto

Microstructures, electronics, nanotechnology - these vast fields of



research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps.In this volume, authors from three major competence centres for microengineering illustrate step by step the process from designing and simulating microcomponents of