Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package / / edited by Beth Keser and Steffen Kröhnert

• Record Nr.: UNINA9910830048403321
• Pubbl/distr/stampa: Piscataway, New Jersey ; ; Hoboken, New Jersey : , : IEEE Press : , : Wiley, , [2022]; ©2022
• ISBN: 1-119-79389-0; 1-119-79390-4; 1-119-79384-X
• Descrizione fisica: 1 online resource (323 pages)
• Collana: IEEE Press
• Disciplina: 621.395
• Soggetti: Chip scale packaging; Integrated circuits - Wafer-scale integration; Microelectronics
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Nota di bibliografia: Includes bibliographical references and index.