Metal powder-based additive manufacturing / / Kun Zhou and Changjun Han

• Record Nr.: UNINA9910829998203321
• Autore: Zhou Kun <1934->
• Pubbl/distr/stampa: Weinheim, Germany : , : WILEY-VCH GmbH, , [2023]; ©2023
• ISBN: 3-527-82224-0; 3-527-82222-4
• Descrizione fisica: 1 online resource (319 pages)
• Disciplina: 031
• Soggetti: Additive manufacturing; Metal powders
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: Cover -- Title Page -- Copyright -- Contents -- Biography -- Preface -- Chapter 1 Introduction -- 1.1 History and Fundamentals of AM -- 1.2 AM Techniques -- 1.3 Metal Powder-Based AM -- 1.4 Post‐Processing -- 1.4.1 Surface Quality Improvement -- 1.4.2 Residual Stress Relief and Defect Reduction -- 1.4.3 Aesthetic Improvement -- 1.5 Powder Properties and Characterization Methods -- 1.5.1 Particle Morphology -- 1.5.2 Particle Size Distribution -- 1.5.3 Density -- 1.5.4 Flowability -- 1.5.5 Chemical Composition -- 1.5.5.1 Surface Analysis Methods -- 1.5.5.2 Bulk Analysis Methods -- 1.5.6 Microstructure -- 1.6 Challenges and Future Trends of Metal Powder-Based AM -- 1.7 Summary -- References -- Chapter 2 Metal Powder Preparation Processes -- 2.1 Atomization -- 2.1.1 Gas Atomization -- 2.1.2 Water Atomization -- 2.1.3 Plasma Atomization -- 2.1.4 Plasma Rotating Electrode Process -- 2.2 Mechanical Mixing -- 2.3 Reduction Process -- 2.3.1 Hydride-Dehydride Process -- 2.3.2 Oxide Reduction -- 2.3.3 Chloride Reduction -- 2.3.4 Carbonyl Reactions -- 2.4 Powder Modification -- 2.4.1 Plasma Spheroidization -- 2.4.2 Granulation-Sintering-Deoxygenation -- 2.4.3 Fluidized‐bed Granulation -- 2.5 Summary -- References -- Chapter 3 Laser Powder Bed Fusion -- 3.1 History -- 3.2 Fundamentals -- 3.3 Printing Process -- 3.3.1 Melt Pool -- 3.3.2 Balling -- 3.3.3 Spattering -- 3.4 Metallurgical Defects -- ; 3.4.1 Porosity -- 3.4.2 Cracks and Warpage -- 3.5 Powder Materials -- 3.6 Equipment -- 3.7 Typical Materials Used in LPBF -- 3.7.1 Titanium and Its Alloys -- 3.7.2 Aluminum Alloys -- 3.7.3 Nickel Alloys -- 3.7.4 Iron Alloys -- 3.7.5 Others -- 3.7.5.1 Cobalt Alloys -- 3.7.5.2 Copper Alloys -- 3.7.5.3 Magnesium Alloys -- 3.7.5.4 High‐Entropy Alloys -- 3.8 Mechanical Metamaterials for LPBF -- 3.8.1 Fundamentals of Mechanical Metamaterials.; 3.8.2 Mechanical Metamaterials with High Young's Modulus -- 3.8.3 Mechanical Metamaterials with High Shear and Bulk Moduli -- 3.8.4 Mechanical Metamaterials with Zero or Negative Poisson's Ratio -- 3.9 Summary -- References -- Chapter 4 Electron Beam Melting -- 4.1 History -- 4.2 Fundamentals -- 4.3 Preheating and Melting Processes -- 4.4 Metallurgical Defects -- 4.5 Powder Materials -- 4.6 Equipment -- 4.7 Microstructures and Mechanical Properties -- 4.7.1 Titanium and Its Alloys -- 4.7.2 Nickel Alloys -- 4.7.3 Cobalt Alloys -- 4.7.4 Iron Alloys -- 4.7.5 Others -- 4.7.5.1 Copper and Its Alloys -- 4.7.5.2 High‐Entropy Alloys -- 4.8 Summary -- References -- Chapter 5 Laser‐Based Directed Energy Deposition -- 5.1 History -- 5.2 Fundamentals -- 5.3 Deposition Process -- 5.4 Metallurgical Defects -- 5.5 Powder Materials -- 5.6 Equipment -- 5.7 Microstructure and Mechanical Properties -- 5.7.1 Titanium and Its Alloys -- 5.7.2 Nickel Alloys -- 5.7.3 Iron Alloys -- 5.7.4 Others -- 5.7.4.1 Aluminum Alloys -- 5.7.4.2 Copper and Its Alloys -- 5.7.4.3 High‐Entropy Alloys -- 5.8 Summary -- References -- Chapter 6 Metal Binder Jetting -- 6.1 History -- 6.2 Fundamentals -- 6.3 Printing Process -- 6.4 Raw Materials -- 6.5 Equipment -- 6.6 Microstructure and Mechanical Properties -- 6.6.1 Iron Alloys -- 6.6.2 Nickel Alloys -- 6.6.3 Titanium and Its Alloys -- 6.6.4 Copper and Its Alloys -- 6.6.5 Refractory Metals -- 6.6.6 Others -- 6.7 Summary -- References -- Chapter 7 Applications -- 7.1 Aerospace -- 7.2 Biomedical -- 7.3 Automotive -- 7.4 Molding and Tooling -- 7.5 Energy -- 7.6 Jewelry -- 7.7 Marine, Oil, and Gas -- 7.8 Challenges and Risks -- References -- Index -- EULA.