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Record Nr. |
UNINA9910829919103321 |
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Autore |
Lee Shi-Wei Ricky (HKUST.) |
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Titolo |
From LED to solid state lighting : principles, materials, packaging, characterization, and applications / / Shi-Wei Ricky Lee [et al.] |
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Pubbl/distr/stampa |
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Hoboken, NJ : , : John Wiley & Sons, Inc., , 2022 |
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ISBN |
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1-118-88155-9 |
1-118-88162-1 |
1-118-88158-3 |
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Descrizione fisica |
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Disciplina |
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Soggetti |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Nota di contenuto |
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Cover -- Title Page -- Copyright -- Contents -- Preface -- About the Authors -- Chapter 1 LEDs for Solid‐State Lighting -- 1.1 Introduction -- 1.2 Evolution of Light Sources and Lighting Systems -- 1.3 Historical Development of LEDs -- 1.4 Implementation of White Light Illumination with an LED -- 1.5 LEDs for General Lighting -- References -- Chapter 2 Packaging of LED Chips -- 2.1 Introduction -- 2.2 Overall Packaging Process and LED Package Types -- 2.2.1 PTH LED Component -- 2.2.2 SMD LED Component -- 2.3 Chip Mounting and Interconnection -- 2.3.1 Die Attach Adhesive -- 2.3.2 Soldering and Eutectic Bonding -- 2.3.3 Wire Bonding -- 2.3.4 Flip‐Chips -- 2.4 Phosphor Coating and Dispensing Process -- 2.4.1 Dispersed Dispensing -- 2.4.2 Conformal Coating -- 2.4.3 Remote Phosphor -- 2.5 Encapsulation and Molding Process -- 2.5.1 Encapsulant Filling with Lens -- 2.5.2 Lens Molding -- 2.6 Secondary Optics and Lens Design -- References -- Chapter 3 Chip Scale and Wafer Level Packaging of LEDs -- 3.1 Introduction -- 3.2 Chip Scale Packaging -- 3.3 Enabling Technologies for Wafer Level Packaging -- 3.3.1 Photolithography -- 3.3.2 Wafer Etching -- 3.3.3 TSV Filling -- 3.3.4 Bond Pad Metallization -- 3.3.5 Wafer Level Phosphor Deposition Methods -- 3.3.5.1 Wafer Level Phosphor Stencil Printing -- 3.3.5.2 Waffle Pack Remote Phosphor Film -- 3.3.5.3 Remote Phosphor Dispensing on a Pre‐Encapsulated Silicone Lens -- 3.3.6 Moldless Encapsulation -- 3.4 Designs and Structures of LED |
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Wafer Level Packaging -- 3.4.1 Reflective Layer Design -- 3.4.2 Cavity and Reflective Cup by Wet Etching -- 3.4.3 Copper‐Filled TSVs for Vertical Interconnection and Heat Dissipation -- 3.5 Processes of LED Wafer Level Packaging -- 3.5.1 Case 1: Multichip LED WLP with Through Silicon Slots -- 3.5.2 Case 2: LED WLP with a Cavity -- 3.5.3 Case 3: Applications of an LED WLP Panel. |
References -- Chapter 4 Board Level Assemblies and LED Modules -- 4.1 Introduction -- 4.2 Board Level Assembly Processes -- 4.2.1 Metal Core Printed Circuit Board -- 4.2.2 Printed Circuit Board with Thermal Vias -- 4.2.3 Wave Soldering -- 4.2.4 Surface Mount Reflow -- 4.3 Chip‐on‐Board Assemblies -- 4.4 LED Modules and Considerations -- References -- Chapter 5 Optical, Electrical, and Thermal Performance -- 5.1 Evaluation of Optical Performance -- 5.1.1 Basic Concepts of Radiometric and Photometric -- 5.1.2 Irradiance Measurement Calibration -- 5.1.3 Common Measurement Equipment -- 5.2 Power Supply and Efficiency -- 5.2.1 Electrical Characteristics of LED -- 5.2.2 Power Supply for LEDs -- 5.2.3 Power Efficiency -- 5.3 Consideration of LED Thermal Performance -- 5.3.1 Thermal Characterization Methods for LEDs -- 5.3.2 Thermal Management Methods -- References -- Chapter 6 Reliability Engineering for LED Packaging -- 6.1 Concept of Reliability and Test Methods -- 6.1.1 Reliability of Electronic Components or Systems -- 6.1.2 Common Failure Mechanisms and Reliability Tests -- 6.2 Failure Analysis and Life Assessment -- 6.2.1 Methodology for Failure Analysis -- 6.2.2 Weibull Analysis and Acceleration Model for Life Assessment -- 6.3 Design for Reliability -- References -- Chapter 7 Emerging Applications of LEDs -- 7.1 LEDs for Automotive Lighting -- 7.1.1 Development -- 7.1.2 Typical Structures -- 7.1.3 Challenges -- 7.1.3.1 Electric Driver -- 7.1.3.2 Optical Design -- 7.1.3.3 Thermal Optimization -- 7.1.4 Conclusion -- 7.2 Micro‐ and Mini‐LED Display -- 7.2.1 Development -- 7.2.1.1 Development of Mini‐LED Display -- 7.2.1.2 Development of Micro‐LED Displays -- 7.2.2 Typical Structures -- 7.2.3 Challenges -- 7.2.4 Conclusion -- 7.3 LED for Visible Light Communication -- 7.3.1 Development -- 7.3.2 Typical Applications -- 7.3.2.1 Li‐Fi. |
7.3.2.2 Traffic Communication -- 7.3.2.3 Smart City -- 7.3.3 Challenges -- 7.3.3.1 Multiple Input and Multiple Output (MIMO) -- 7.3.3.2 Reliability and Network Coverage -- 7.3.3.3 Other Challenges -- 7.3.4 Conclusion -- References -- Chapter 8 LEDs Beyond Visible Light -- 8.1 Applications of UV‐LED -- 8.1.1 Structures -- 8.1.1.1 UV‐LED Chip -- 8.1.1.2 UV‐LED Package -- 8.1.2 Applications -- 8.1.2.1 Sterilization and Disinfection -- 8.1.2.2 Curing -- 8.1.2.3 UV Communications Technology -- 8.1.2.4 White Light Generation -- 8.1.2.5 Medical Treatment -- 8.1.3 Challenges -- 8.1.3.1 Heteroepitaxy of DUV‐LEDs -- 8.1.3.2 Doping of AlGaN UV‐LEDs and External Quantum Efficiency -- 8.1.3.3 Thermal Degradation -- 8.1.3.4 Structures of UV‐LED Packages -- 8.1.3.5 Materials of UV‐LED Packages -- 8.1.4 Conclusion -- 8.2 Applications of IR‐LEDs -- 8.2.1 Structures -- 8.2.2 Applications -- 8.2.2.1 Sensors and Detecting -- 8.2.2.2 Imaging Techniques -- 8.2.2.3 Biomedical Engineering -- 8.2.3 Challenges -- 8.2.3.1 Monolithic Integration -- 8.2.3.2 Driving Currents and Efficiency -- 8.2.3.3 Thermal Management -- 8.2.4 Conclusion -- 8.3 Future Outlook and Other Technology Trends -- 8.3.1 Better Light Sources -- 8.3.1.1 Display Technology -- 8.3.1.2 High‐Quality Light -- 8.3.1.3 Special Light Sources -- 8.3.2 Interconnection -- 8.3.3 Interaction with Humans -- 8.3.4 Light on Demand -- References -- Index -- EULA. |
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Sommario/riassunto |
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"Light-emitting diode (LED) is a semiconductor device based on the effect of electroluminescence. Due to the limitation in efficacy and the |
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lack of white light, LED was not suitable for general lighting applications in the past. With the advancement of semiconductor materials and packaging technologies, the illumination performance of LED has been greatly improved. Ten years ago high power (one watt) white LEDs were introduced with efficiencies high enough to trigger serious discussions on using LEDs for solid-state lighting (SSL) applications."-- Provided by publisher |
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