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Record Nr. |
UNINA9910828839503321 |
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Autore |
Gupta K. M. |
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Titolo |
Advanced electrical and electronics materials : processes and applications / / K. M. Gupta and Nishu Gupta ; cover design by Russell Richardson |
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Pubbl/distr/stampa |
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Hoboken, New Jersey : , : Scrivener Publishing, , 2015 |
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©2015 |
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ISBN |
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1-118-99857-X |
1-118-99856-1 |
1-118-99858-8 |
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Descrizione fisica |
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1 online resource (1140 p.) |
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Collana |
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Disciplina |
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Soggetti |
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Capacitors |
Electric resistors |
Electronics - Materials |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references at the end of each chapters and index. |
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Nota di contenuto |
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Cover; Half Title page; Title page; Copyright page; Dedication; Preface; Acknowledgement; About the Authors; Abbreviations; Chapter 1: General Introduction to Electrical and Electronic Materials; 1.1 Importance of Materials; 1.2 Importance of Electrical and Electronic Materials; 1.3 Classification of Electrical and Electronic Materials; 1.4 Scope of Electrical and Electronic Materials; 1.5 Requirements of Engineering Materials; 1.6 Operational Requirements of Electrical and Electronic Materials; 1.7 Classification of Solids on the Basis of Energy Gap |
1.8 Glimpse of Some Electronic Products, Their Working Principles and Choicest Materials1.9 Different Types of Engineering Materials; 1.10 Different Levels of Materials Structure; 1.11 Spintronics (The Electronics of Tomorrow) and Spintronic Materials; 1.12 Ferromagnetic Semiconductor; 1.13 Left-Handed (LH) Materials; 1.14 Solved Examples; Chapter 2: Atomic Models, Bonding in Solids, Crystal Geometry, and Miller Indices; 2.1 Atomic Models; 2.2 Bohr's Quantum |
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Atomic Model; 2.3 Modern Concept of Atomic Model; 2.4 Electron Configuration; 2.5 Meaning of Chemical (or Atomic) Bonding |
2.6 Classification of Chemical Bonds2.7 Ionic Bond; 2.8 Covalent Bonds; 2.9 Monocrystalline and Polycrystalline Crystal Structures; 2.10 Space Lattice; 2.11 Basis; 2.12 Unit Cell and Crystal; 2.13 Bravais Crystal System; 2.14 Primitive and Non-Primitive Unit Cells; 2.15 Coordination Number; 2.16 Atomic Packing Fraction; 2.17 Calculation of Density (or Bulk Density); 2.18 Miller Indices; 2.19 Interplaner Spacing; 2.20 Linear Density; 2.21 Planer Density; Chapter 3: Solid Structures, Characterization of Materials, Crystal Imperfections, and Mechanical Properties of Materials |
3.1 Crystallography3.2 Crystalline and Non-Crystalline Structures; 3.3 Hexagonally Closed Packed Structure (HCP); 3.4 VOIDS; 3.5 Covalent Solids; 3.6 Bragg's Law of X-Rays Diffraction; 3.7 Structure Determination; 3.8 Microscopy; 3.9 Different Types of Metallurgical Microscopes and Their Features; 3.10 Working Principle of Electron Microscope; 3.11 Ideal and Real Crystals, and Imperfections; 3.12 Classification of Imperfections; 3.13 Point Imperfections; 3.14 Effects of Point Imperfections; 3.15 Line Imperfections; 3.16 Features of Edge Dislocation; 3.17 Screw Dislocation |
3.18 Characteristics of Dislocations3.19 Sources of Dislocations, Their Effects and Remedies; 3.20 Grain Boundary; 3.21 Twin or Twinning; 3.22 Mechanical Properties of Metals; Chapter 4: Conductive Materials: Electron Theories, Properties and Behaviour; 4.1 Electrons and Their Role in Conductivity; 4.2 Electron Theories of Solids; 4.3 Free Electron Theory; 4.4 Energy Band Theory; 4.5 Brillouin Zone Theory; 4.6 Conductors; 4.7 Factors Affecting Conductivity (and Resistivity) of Metals; 4.8 Thermal Conductivity; 4.9 Heating Effect of Current; 4.10 Thermoelectric Effect (or Thermoelectricity) |
4.11 Seebeck Effect |
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Sommario/riassunto |
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This comprehensive and unique book is intended to cover the vast and fast-growing field of electrical and electronic materials and their engineering in accordance with modern developments. Basic and pre-requisite information has been included for easy transition to more complex topics. Latest developments in various fields of materials and their sciences/engineering, processing and applications have been included. Latest topics like PLZT, vacuum as insulator, fiber-optics, high temperature superconductors, smart materials, ferromagnetic semiconductors etc. are covered. Illustrations and exa |
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