Particle adhesion and removal / / edited by K. L. Mittal and Ravi Jaiswal

• Record Nr.: UNINA9910820975703321
• Pubbl/distr/stampa: Hoboken, New Jersey : , : Scrivener Publishing, , 2015; ©2015
• ISBN: 1-118-83154-3; 1-118-83157-8; 1-118-83155-1
• Descrizione fisica: 1 online resource (936 p.)
• Collana: Adhesion and Adhesives : Fundamental and Applied Aspects
• Disciplina: 530.4/17
• Soggetti: Adhesion; Particles; Powders; Surfaces (Technology); Dust - Removal; Cleaning
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: Cover; Half Title page; Title page; Copyright page; Preface; Acknowledgements; Part 1: Particle Adhesion: Fundamentals; Chapter 1: Fundamental Forces in Particle Adhesion; 1.1 Introduction; 1.2 Various Forces in Particle Adhesion; 1.3 Summary; References; Chapter 2: Mechanics of Particle Adhesion and Removal; 2.1 Introduction; 2.2 Models; 2.3 Simulations Results; 2.4 Summary and Conclusions; Acknowledgements; References; Chapter 3: Microscopic Particle Contact Adhesion Models and Macroscopic Behavior of Surface Modified Particles; 3.1 Introduction; 3.2 Constitutive Contact Models; 3.3 Macroscopic Powder Behavior - Continuum Mechanics Approach3.4 Surface Modification to Alter the Adhesion Properties; 3.5 Experimental Measurements of the Adhesion Forces; 3.6 Summary and Conclusions; Acknowledgements; List of Symbols; References; Chapter 4: Characterization of Single Particle Adhesion: A Review of Recent Progress; 4.1 Introduction; 4.2 Background; 4.3 Recent Developments; ; 4.4 Conclusions and Remarks; Acknowledgments; List of Symbols; References; Part 2: Particle Removal Techniques; Chapter 5: High Intensity Ultrasonic Cleaning for Particle Removal; 5.1 Introduction; 5.2 Ultrasound and Ultrasonics5.3 Cavitation Phenomenon; 5.4 Generation of Ultrasound - Transducers; 5.5 Ultrasonic Generators; 5.6 Principles of Ultrasonic Cleaning for Particle Removal; 5.7 Determination of Residual Particles on Surfaces; 5.8 Ultrasonic Aqueous Cleaning Equipment and Process; 5.9 Precision Cleaning; 5.10 Contaminants; 5.11 Ultrasonic Cavitation Forces and Surface Cleaning; 5.12 Cleaning Chemistry; 5.13 Mechanism of Cleaning; 5.14 Cavitation Erosion; 5.15 Summary; References; Chapter 6: Megasonic Cleaning for Particle Removal; 6.1 Introduction; 6.2 Principles of Megasonic Cleaning6.3 Particle Removal Mechanisms During Megasonic Cleaning; 6.4 Types of Megasonic Systems; 6.5 Particle Removal and Feature Damage in Megasonic Cleaning; 6.6 Summary; References; Chapter 7: High Speed Air Jet Removal of Particles from Solid Surfaces; 7.1 Introduction; 7.2 Fundamental Characteristics of the Air Jet; 7.3 Fundamentals of Air Jet Particle Removal; 7.4 New Methods Using Air Jet; 7.5 Summary and Prospect; List of Symbols; References; Chapter 8: Droplet Spray Technique for Particle Removal; 8.1 Introduction; 8.2 Droplet Impact Phenomena; 8.3 Cleaning Process Window8.4 Droplet Spray Technique for Semiconductor Wafer Cleaning; 8.5 Summary; References; Chapter 9: Laser-Induced High-Pressure Micro-Spray Process for Nanoscale Particle Removal; 9.1 Introduction; 9.2 Concept of Droplet Opto-Hydrodynamic Cleaning (DOC); 9.3 Micro-Spray Generation by LIB; 9.4 Mechanisms of Particle Removal by Laser-Induced Spray Jet; 9.5 Generation of Micro-Spray Jet; 9.6 Nanoscale Particle Removal; References; 9.7 Summary; Chapter 10: Wiper-Based Cleaning of Particles from Surfaces; 10.1 Introduction; 10.2 Basic Mechanism of Wiping for Cleaning of Particles and Other Contaminants
• Sommario/riassunto: The book provides a comprehensive and easily accessible reference source covering all important aspects of particle adhesion and removal. The core objective is to cover both fundamental and applied aspects of particle adhesion and removal with emphasis on recent developments. Among the topics to be covered include: 1. Fundamentals of surface forces in particle adhesion and removal.2. Mechanisms of particle adhesion and removal.3. Experimental methods (e.g. AFM, SFA,SFM,IFM, etc.) to understand particle-particle and particle-substrate interactions.4. Mechanics of adhesion of micro- and n