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Record Nr. |
UNINA9910817008203321 |
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Titolo |
Plasma processing of materials : scientific opportunities and technological challenges / / Panel on Plasma Processing of Materials, Plasma Science Committee, Board on Physics and Astronomy, Commission on Physical Sciences, Mathematics, and Applications, National Research Council |
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Pubbl/distr/stampa |
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Washington, D.C., : National Academy Press, 1991 |
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ISBN |
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1-280-20336-6 |
9786610203369 |
0-309-58375-6 |
0-585-08463-7 |
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Edizione |
[1st ed.] |
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Descrizione fisica |
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1 online resource (87 p.) |
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Disciplina |
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Soggetti |
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Plasma engineering |
Microelectronics - Materials - Effect of radiation on |
Surfaces (Technology) |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Bibliographic Level Mode of Issuance: Monograph |
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Nota di contenuto |
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Plasma Processing of Materials: -- Copyright -- Preface -- Acknowledgments -- Contents -- 1 Summary, Findings, Conclusions, And Recommendations -- SUMMARY -- FINDINGS, CONCLUSIONS, AND RECOMMENDATIONS -- 2 Plasma Processing And Low-Energy Plasma Science -- CLASSIFICATION OF PLASMAS -- BRIEF HISTORY OF LOW-ENERGY PLASMA SCIENCE AND TECHNOLOGY -- INDUSTRIAL APPLICATIONS OF PLASMA PROCESSING OF MATERIALS -- INTERFACE BETWEEN BASIC PLASMA SCIENCE AND APPLICATIONS -- SCOPE OF THIS REPORT -- 3 Plasma Processing In The Electronics Industry -- MICROELECTRONICS FABRICATION -- PLASMA ETCHING -- Anisotropy -- Selectivity -- Uniformity -- Damage -- New Materials -- PLASMA DEPOSITION -- Planarization, Filling, and Interconnection -- Surface Modification -- New Materials -- PLASMA CLEANING -- LOW-PRESSURE PLASMA REACTOR TECHNOLOGY -- Single-Wafer Processing -- Process Control -- New Plasma Sources -- Magnetic Confinement -- |
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Downstream Processing -- Modulated Processing -- Clustered Processing -- THERMAL PLASMA REACTOR TECHNOLOGY -- TOWARD FLEXIBLE MICROELECTRONICS MANUFACTURING -- FINDINGS AND CONCLUSIONS -- 4 Scientific Foundation of Plasma Processing -- SURFACE PROCESSES -- Theory and Simulation -- Experimental Studies -- Beam-Surface Experiments -- Ex Situ Analysis -- PLASMA GENERATION AND TRANSPORT -- Low-Pressure Plasma Modeling -- Analysis -- Fluid Simulations -- Particle-In-Cell and Kinetic Simulations -- Thermal Plasma Modeling -- Toward Cad Tools And Expert Systems -- Chemical Kinetics -- Multidimensional Modeling and Magnetic Effects -- Stability of Processing Plasmas -- Accuracy and Reliability of Numerical Simulation Methods -- Plasma Diagnostics -- Positive Ions and Neutrals -- Electron Density and Energy Distribution -- Fields -- Negative Ions -- Particulates -- Reference Reactors -- Data Base for Plasma Generation and Transport -- Present Status. |
Needs -- Distribution of Information -- PLASMA-SURFACE INTERACTIONS -- Boundary Conditions -- Passive Surfaces -- Particulates -- Microstructure Evolution -- In Situ Analysis -- FUNDING FOR PLASMA PROCESSING RESEARCH -- Japanese Research -- French Research -- FINDINGS AND CONCLUSIONS -- 5 Educational Issues -- EDUCATIONAL REQUIREMENTS FOR UNDERGRADUATES -- Laboratory Courses and the Scientific Method -- Research Experiences and Cooperative Programs -- U.S. GRADUATE EDUCATION -- TEXTS AND COMPUTER-AIDED INSTRUCTION -- FACULTY DEVELOPMENT -- CONTINUING EDUCATION -- FOREIGN EDUCATIONAL OFFERINGS -- Japan -- France -- FINDINGS AND CONCLUSIONS -- Appendix Participants in Workshop on Plasma Processing of Materials. |
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