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Record Nr. |
UNINA9910815016903321 |
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Titolo |
Handbook of wafer bonding / / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo |
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Pubbl/distr/stampa |
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Weinheim, Germany, : Wiley-VCH, 2012 |
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ISBN |
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3-527-64423-7 |
1-280-66282-4 |
9786613639752 |
3-527-64422-9 |
3-527-64424-5 |
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Edizione |
[1st ed.] |
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Descrizione fisica |
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1 online resource (430 p.) |
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Altri autori (Persone) |
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RammPeter |
LuJames Jian-Qiang |
TakloMaaike M. V |
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Disciplina |
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Soggetti |
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Semiconductors - Bonding |
Semiconductor wafers |
Microelectromechanical systems - Design and construction |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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pt. 1. Technologies -- pt. 2. Applications. |
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Sommario/riassunto |
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Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices. |
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