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Record Nr. |
UNINA9910814246103321 |
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Titolo |
Applied decisions in area of mechanical engineering and industrial manufacturing : selected, peer reviewed papers from the 3rd International Conference on Mechanical, Control, and Electronic Information (ICMCEI 2014), June 27-29, 2014, Taiwan / / edited by Kuang-Chao Fan |
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Pubbl/distr/stampa |
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Zurich, Switzerland : , : TTP, , 2014 |
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©2014 |
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ISBN |
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Descrizione fisica |
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1 online resource (1337 p.) |
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Collana |
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Applied Mechanics and Materials, , 1662-7482 ; ; Volume 577 |
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Disciplina |
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Soggetti |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references at the end of each chapters and indexes. |
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Nota di contenuto |
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Applied Decisions in Area of Mechanical Engineering and Industrial Manufacturing; Preface, Committees and Sponsors; Table of Contents; Chapter 1: Materials Science and Processing; Modeling and Analysis the Effect of Helical Carbon Nanotube Morphology on the Mechanical Properties of Nanocomposites Using Hexagonal Representative Volume Element; The Catalyzed Synthesis of Prenyl Alcohol; Preparation and Effect of Heat Treatment Temperature on the Crystal Phase of Anodic Aluminum Oxide Films; Effect of Preparation Conditions on the Performance of Electrodeposited Mo-Ni Coating |
The Room Temperature Ferromagnetism of (N, Co) Co-Doped ZnO NanopaticlesStress Corrosion Cracking of Stainless Steel Expansion Joint for Heat-Supply Network; Study on the Effect of Fuel Sulfur Content on Emission Characteristics in Diesel Engine; Research on Emission Performances of Emulsified Diesel Oil with Diethyl Ether; Experimental Study on Frictional Resistance Characteristics of CO2-Emulsified Viscoelastic Surfactant Fracturing Fluid; Effect of Electrical Conductivity and Physical Performance about Vulcanization System in Conductive Silicon Rubber |
Numerical Simulation of Borehole Heat Transfer with Phase Change |
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Material as GroutCharacteristic of Porous Carbon Fiber and its Microwave Absorption as Filler for Composite; Preparation and Characterization of Proton Exchange Membrane Based on Sulfonated Poly(arylene ether sulfone)/Polyacrylonitrile (SPAES/PAN); Preparation and Properties of MWCNTs/ PBO Membrane by Electrospinning; Study on Microstructure of NiCrMoY Alloy Coatings; Application of Magnetic Control Shape Memory Alloy in Structural Vibration Control |
Co-Gasification Characteristic and Kinetic Analysis of Spent Mushroom Compost and Bituminous CoalEffect of TMCP Parameters on Microstructure and Mechanical Properties of Cargo Oil Tanks Steel; Helium Bubbles Effect on the Mechanical Properties of CLAM Alloys by Milte-Scale Simulations; Aluminium Alloy Welding the Weld Stress Deformation and Control; Maintenance Optimization of the OLED Manufacturing Process; Research on Spring-Back Simulation and Die Surface Optimization of Automotive Panel Stamping Process; The Converter Steelmaking End Point Prediction Model Based on RBF Neural Network |
Structural Phase Transition and Electronic Properties of MgCe under High Pressure from First-Principles CalculationsStudy on Machining Mechanism of Glass Using Discrete Element Method; Population Transfer in Multilevel System via Modified Stimulated Raman Adiabatic Passage; Chapter 2: General Mechanical Engineering and Applied Mechanics; A Method for Double Random Vibration Analysis; Analysis of Dynamic Characteristics on Continuous Tension Leveler; Analysis of Hydraulic Jarring Dynamics and Calculation of Impact Force |
Analysis of the Influence of Superelevation of Subway Line Act on Wheel-Rail Wear |
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Sommario/riassunto |
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Collection of selected, peer reviewed papers from the 3rd International Conference on Mechanical, Control, and Electronic Information (ICMCEI 2014), June 27 -29, 2014, Taiwan. The 283 papers are grouped as follows: Chapter 1: Materials Science and Processing, Chapter 2: General Mechanical Engineering and Applied Mechanics, Chapter 3: Mechatronics, Control Systems and Robotics, Chapter 4: Electrical Engineering, Apparatus and Power Engineering, Chapter 5: Electronics and Integrated Circuits, Embedded Technology, Chapter 6: Measurements, Testing and Monitoring, Chapter 7: Signal, Image Processin |
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