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Record Nr. |
UNINA9910791816603321 |
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Titolo |
VLSI and computer architecture [[electronic resource] /] / Kenzo Watanabe, editor |
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Pubbl/distr/stampa |
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New York, : Nova Science Publisher, c2009 |
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ISBN |
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Descrizione fisica |
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1 online resource (253 p.) |
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Altri autori (Persone) |
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Disciplina |
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Soggetti |
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Integrated circuits - Very large scale integration - Design and construction |
Computer architecture |
Wireless communication systems - Equipment and supplies - Design and construction |
Microcontrollers - Design and construction |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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""VLSI AND COMPUTERARCHITECTURE""; ""VLSI AND COMPUTER ARCHITECTURE ""; ""CONTENTS""; ""PREFACE""; ""DESIGN CONSIDERATIONS AND ALGORITHMSFOR BROADBAND FIXED WIMAX SYSTEMS""; ""Abstract""; ""1. Introduction""; ""1.1. Introduction""; ""1.2. Orthogonal Frequency Division Multiplexing (OFDM)""; ""1.2.1. Non-iterative OFDM Scheme""; ""1.2.2. Iterative OFDM Scheme""; ""1.3. SC-FDE""; ""1.4. Quantitative Results""; ""2. Time-Domain Solutions""; ""2.1. Time-Domain Turbo Equalization for SISO System""; ""2.1.1. Initial stage""; ""2.1.2. Subsequent Stages""; ""2.1.3. Complexity Comparison"" |
""2.2. Time-Domain Turbo Equalization for MIMO Systems""""2.2.1. Initial Stage""; ""2.2.2. Subsequent Stages""; ""2.3. Performance Comparison""; ""3. Conclusions""; ""References""; ""VLSI INTERCONNECTS AND THEIR DELAYPERFORMANCE""; ""Abstract""; ""1. Introduction""; ""2. Modeling Interconnect as RC & RLC Circuits""; ""2.1. Lumped and Distributed Models""; ""3. Extraction of Interconnect Parasitics""; ""4. Propagation Delay through Driver Interconnect Load Model""; ""4.1. Driver Delay Models""; ""4.2. Interconnect Delay Models""; ""4.3. Composite Driver-Interconnect-Load Model-A Case Study"" |
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