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1. |
Record Nr. |
UNINA9910789995003321 |
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Autore |
Fukushima Masatoshi <1935-> |
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Titolo |
Dirichlet forms and symmetric Markov processes [[electronic resource] /] / by Masatoshi Fukushima, Yoichi Oshima, Masayoshi Takeda |
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Pubbl/distr/stampa |
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Berlin ; ; New York, : De Gruyter, c2010 |
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ISBN |
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1-283-16483-3 |
9786613164834 |
3-11-021809-7 |
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Edizione |
[2nd rev. and ext. ed.] |
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Descrizione fisica |
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1 online resource (500 p.) |
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Collana |
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De Gruyter studies in mathematics, , 0179-0986 ; ; 19 |
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Classificazione |
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Altri autori (Persone) |
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OshimaYoichi |
TakedaMasayoshi |
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Disciplina |
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Soggetti |
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Markov processes |
Dirichlet forms |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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pt. 1. Dirichlet forms -- pt. 2. Symmetric Markov processes. |
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Sommario/riassunto |
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This book contains an introductory and comprehensive account of the theory of (symmetric) Dirichlet forms. Moreover this analytic theory is unified with the probabilistic potential theory based on symmetric Markov processes and developed further in conjunction with the stochastic analysis based on additive functional. Since the publication of the first edition in 1994, this book has attracted constant interests from readers and is by now regarded as a standard reference for the theory of Dirichlet forms. For the present second edition, the authors not only revised the existing text, but also added sections on capacities and Sobolev type inequalities, irreducible recurrence and ergodicity, recurrence and Poincaré type inequalities, the Donsker-Varadhan type large deviation principle, as well as several new exercises with solutions. The book addresses to researchers and graduate students who wish to comprehend the area of Dirichlet forms and symmetric Markov processes. |
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2. |
Record Nr. |
UNINA9910783323603321 |
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Autore |
Schnetz Martina |
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Titolo |
The healing flow [[electronic resource] ] : artistic expression in therapy : creative arts and the process of healing : an image/word approach inquiry / / Martina Schnetz ; foreword by V. Darroch-Lozowski ; foreword by David Wright |
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Pubbl/distr/stampa |
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Philadelphia, PA, : Jessica Kingsley, 2004 |
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ISBN |
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1-280-26177-3 |
9786610261772 |
1-84642-062-8 |
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Edizione |
[1st American pbk. ed.] |
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Descrizione fisica |
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1 online resource (253 p.) |
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Disciplina |
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Soggetti |
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Art therapy |
Healing |
Imagery (Psychology) - Therapeutic use |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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Cover; The Healing Flow: Artistic Expression in Therapy, Creative Arts and the Process of Healing: An Image/Word Approach Inquiry; Contents; Acknowledgments; Foreword by Vivian Darroch-Lozowski; Foreword by David C. Wright; Part 1 Interpretative Quilting: A Qualitative Art-Based Approach to Inquiry; 1 Introduction to the Healing Flow: An Image Oriented Approach to Inquiry and Psychotherapy; 2 Interpretative Quilting as a Qualitative Approach to Inquiry; 3 The Nature of Truth in Interpretative Quilting |
Part 2 An Interpretative Quilt: A Qualitative Study of the Healing Flow within a Clinical Setting4 The Role of Contextual Factors in Interpretative Quilting; 5 A Window: Entering the Art Therapy Room; 6 Sam's Journey with the Healing Flow; 7 Mary's Journey with the Healing Flow; 8 A View into the Activities in an Art Therapy Session; 9 Verbal Reflection Phase of the Healing Flow of Images and the Quality of the Dialogical Image/Word Process; 10 Transition Phase and Closing Ritual as a Container of the |
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Sommario/riassunto |
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Drawing on her extensive experience as a creative arts therapist, |
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Martina Schnetz puts forward a new approach to the process of art in healing. She explores the dialogue between the internal world, external images, and words, shaping a new vocabulary for creative arts therapists. The Healing Flow is a theoretical and experiential account of the author's work with survivors of childhood trauma and post traumatic stress. Case studies are presented in this model. Through providing deeper insight into the creative processes, participants recover meaningful patterns in their lives, and restore conn |
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3. |
Record Nr. |
UNINA9910829927203321 |
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Autore |
Menz W (Wolfgang) |
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Titolo |
Microsystem technology / / W. Menz, J. Mohr, and O. Paul |
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Pubbl/distr/stampa |
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Weinheim, Germany ; ; New York, New York : , : Wiley-VCH, , [2001] |
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©2001 |
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ISBN |
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1-281-76403-5 |
9786611764036 |
3-527-61300-5 |
3-527-61301-3 |
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Descrizione fisica |
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1 online resource (515 p.) |
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Disciplina |
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Soggetti |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references (pages [465]-483) and index. |
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Nota di contenuto |
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Microsystern Technology; Content; 1 General Introduction to Microstructure Technology; 1.1 What is Microstructure Technology?; 1.2 From Microstructure Technology to Microsystems Technology; 2 The Parallels to Microelectronics; 2.1 The Production of Single Crystal Wafers; 2.1.1 Production of Silicon-Single Crystals; 2.1.2 Production of GaAs Single Crystals; 2.2 Basic Technical Processes; 2.2.1 Film Deposition; 2.2.2 Lithography (Film Patterning); 2.2.3 Surface Modification; 2.2.4 Etching (Film Removal); 2.3 Packaging Technology; 2.3.1 Requirements for Packaging Technology |
2.3.2 Hybrid Technology2.4 Clean Room Techniques; 3 The Physical |
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and Chemical Basics in Microtechnology; 3.1 Crystals and Crystallography; 3.1.1 Lattice and Types of Lattices; 3.1.2 Stereographic Projection; 3.1.3 The Silicon Single Crystal; 3.1.4 Reciprocal Lattice and the Analysis of the Crystal Structure; 3.2 Methods to Determine the Crystalline Structure; 3.2.1 X-ray Diffraction; 3.2.2 Electron Beam Diffraction; 3.3 Basic Concepts of Electroplating; 3.3.1 The Electrode-Electrolyte Interface; 3.3.2 Polarization and Overpotential; 3.3.3 Mechanisms of Cathodic Metal Deposition |
3.4 Materials of Microsystems Technology4 Basic Technologies in MEMS; 4.1 Basic Principles of Vacuum Technology; 4.1.1 The Mean Free Path; 4.1.2 The Monolayer Time; 4.1.3 Velocity of Atoms and Molecules; 4.1.4 Gas Dynamics; 4.1.5 The Classification of Technical Vacuums; 4.2 Vacuum Production; 4.2.1 Pumps for Rough- and Fine Vacuums; 4.2.2 High Vacuum- and Ultrahigh Vacuum Pumps; 4.3 Vacuum Measurement; 4.3.1 Pressure Transducer; 4.3.2 Thermal Conductivity Vacuum Gauge; 4.3.3 Friction Type Vacuum Gauge; 4.3.4 Thermionic Ionization Vacuum Gauge |
4.3.5 Cold Cathode Ionization Gauge (Penning Principle)4.3.6 Leakage and Leak Detection; 4.4 Properties of Thin Films; 4.4.1 Structure Zone Model; 4.4.2 Adhesive Strength of the Layer; 4.5 Physical and Chemical Coating Techniques; 4.5.1 Evaporation; 4.5.2 Sputtering; 4.5.3 Ion Plating or Plasma Assisted Deposition; 4.5.4 Ion Cluster Beam Technology; 4.5.5 CVD Processes; 4.5.6 Epitaxy; 4.5.7 Plasma Polymerization; 4.5.8 Oxidation; 4.6 Structuring of Thin Films with Dry Etch Processes; 4.6.1 Physical Etch Technologies; 4.6.2 Combined Physical and Chemical Etch Technologies |
4.6.3 Chemical Etching Technologies4.7 Analysis of Thin Films and Surfaces; 4.7.1 Electron Probe Microanalysis (EPM); 4.7.2 Auger Electron Spectroscopy (AES); 4.7.3 X-Ray Photoelectron Spectroscopy (XPS); 4.7.4 Secondary Ion Mass Spectroscopy (SIMS); 4.7.5 Secondary Neutral Particle Mass Spectroscopy (SNMS); 4.7.6 Ion Scattering Spectroscopy (ISS); 4.7.7 Rutherford Back Scattering Spectroscopy (RBS); 4.7.8 Scanning Tunneling Microscope; 5 Lithography; 5.1 Overview and History; 5.2 Resists; 5.3 Process of Lithography; 5.4 Computer Aided Design (CAD); 5.4.1 CAD-Layout |
5.4.2 Alignment Patterns and Test Structures |
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Sommario/riassunto |
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This completely revised edition of a bestselling concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include application aspects in medicine and health technology, lithography and electroplating. |
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