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Record Nr. |
UNINA9910786505403321 |
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Autore |
Kwok H. L. |
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Titolo |
Electronic materials / / [written by] H. L. Kwok |
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Pubbl/distr/stampa |
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Stafa-Zuerich, Switzerland ; ; Enfield, New Hampshire : , : Trans Tech Publications LTD, , [2010] |
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©2010 |
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ISBN |
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Descrizione fisica |
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1 online resource (484 p.) |
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Collana |
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Materials science foundations, , 1422-3597 ; ; volumes 63-64 |
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Disciplina |
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Soggetti |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references. |
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Nota di contenuto |
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Electronic Materials; Preamble; Table of Contents ; Table of Contents; Chapter I. THE BASIC STRUCTURES OF SOLIDS; I-1. Introduction. I-2. Atoms and Binding Forces; I-3. Crystal Structures; I-4. Crystalline Solids; I-5. Polycrystalline and Non-Crystalline Solids; I-6. The Phase Diagrams; I-7. Techniques on Crystal Growth and Thin Film Deposition; I-8. Crystal Imperfection; I-9. Diffusion in Solids; I-10. Physical Diagnostic Tools; Glossary; References; Exercises for Chapter I; Chapter II. ELECTRICAL PROPERTIES OF SOLIDS; II-1. Introduction. II-2. Electrons in a Solid |
II-3. Energy Distribution of the ElectronsII-4. The Energy Band Diagram; II-5. Mathematical Formulation of the Conduction Processes; II-6. Conductors; II-7. Semiconductors; II-8. Other Conduction Mechanisms; II-9. Velocity Saturation and Negative-Resistance Effect; II-10. Insulators; Glossary for End-of-Chapter Review; References; Exercises for Chapter II; Chapter III. P-N JUNCTIONS AND RELATED DEVICES; III-1. Introduction. III-2. Concept of a P-N Junction; III-3. Schottky Junction and its Electronic Properties; III-4. Metal-Semiconductor Contact |
III-5. MIS Junction and Field-Effect PropertiesIII-6. Materials Considerations; III-7. Structures and Operation of Transistors; III-8. Non-Ideal Effects and other Performance Parameters; III-9. New Transistors; Glossary for End-of-Chapter Review; References; Exercises for Chapter III; Chapter IV. OPTICAL PROPERTIES OF SOLIDS; IV-1. Introduction. IV-2. Review of the Properties of Light; IV-3. The |
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Absorption Process; IV-4. The Emission Process; IV-5. Imagers; IV-6. Displays; IV-7. Power Generation; IV-8. Optical Signal Transmission Media; Glossary; References; Exercises for Chapter IV |
Chapter V. MAGNETIC AND SUPERCONDUCTING PROPERTIES OF SOLIDSV-1. Introduction; V-2. Magnetic Properties of Solids; V-3. Sources of Magnetization; V-4. Magnetic Anisotropy and Invar Alloys; V-5. Amorphous Magnetic Materials; V-6. Soft Magnets and Hard Magnets; V-7. Magnetic Devices and Applications; V-8. Properties of Superconductors; V-9. Applications of Superconductors; V-10. Superconducting Materials; Glossary for End-of-Chapter Review; References; Exercises for Chapter V; Chapter VI. MICROMACHINES, SENSORS AND PACKAGING MATERIALS; VI-1. Introduction. VI-2. Micromachining |
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Sommario/riassunto |
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The electronic properties of solids have become of increasing importance in the age of information technology. The study of solids and materials, while having originated from the disciplines of physics and chemistry, has evolved independently over the past few decades. The classical treatment of solid-state physics, which emphasized classifications, theories and fundamental physical principles, is no longer able to bridge the gap between materials advances and applications. In particular, the more recent developments in device physics and technology have not necessarily been driven by new conc |
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