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1. |
Record Nr. |
UNINA9910136090103321 |
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Autore |
Glover Douglas |
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Titolo |
The South Will Rise at Noon |
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Pubbl/distr/stampa |
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ISBN |
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Descrizione fisica |
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1 online resource (266 p.) |
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Disciplina |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Sommario/riassunto |
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Hot on the heels of Douglas Glovers Governor Generals Award for fiction for his riotous novel, Elle, Goose Lane has brought back into print Glovers hilarious novel, The South Will Rise at Noon, originally published in 1988. At the centre of this story of a modern-day knight errant is Tully Stamper, a bankrupt, a liar, a tippler of corn juice and a deadbeat husband who has abandoned his wife and child no fraudulent psychiatric grounds. He is also one of the worlds last innocents. The setting for Tullys adventure is Gomez Gap, Florida, a sliver of the Old South turned into a Hollywood backdrop for the movie recreation of a famous Civil War battle. From the time Tully stumbles out of the swamp and into bed with his sleeping ex-wife and her flamboyant film-director husband Oscar Osterwader to the moment when the enraged citizens of Gomez Gap carry him back to the swamp and leave him chained to a pine tree to die, we are Tullys co-conspirators, his partners in crime, sharing his pain, his optimism and his wayward wit. A disarmingly intimate and energetic portrait at once hilarious and cautionary, crazy and bittersweet, The South Will Rise at Noon shows off Douglas Glovers true comic form. |
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2. |
Record Nr. |
UNINA9910783159403321 |
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Titolo |
Substrate technology [[electronic resource]] |
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Pubbl/distr/stampa |
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Bradford, England, : Emerald Group, 2004 |
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Bradford, England : , : Emerald Group, , 2004 |
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ISBN |
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1-280-51439-6 |
9786610514397 |
1-84544-175-3 |
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Descrizione fisica |
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1 online resource (86 p.) |
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Collana |
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Circuit World. No. 4 ; ; Vol. 30 |
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Soggetti |
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Electronic circuits |
Materials science |
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Formato |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di contenuto |
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Contents; English - Abstracts & keywords; French - Abstracts & keywords; German - Abstracts & keywords; Contributors; Editorial; High frequency PCB base materials - a comparison of thermomechanical properties; High performance epoxy copper clad laminate; High-performance substrate from new epoxy resin and enhanced copper foil; An innovative "Chemical Via" process for the production of high density interconnect printed circuit boards; An introduction to high performance laminates and the importance of using optimised chemical processes in PCB fabrication |
A novel method for sequentially-building multi-layer circuits using LCP laminates, cap-layers and bond plysPCB drillability: a material science approach to resin development; What share of the global upturn can Europe retain?; Internet commentary; Book reviews; Intellect commentary; Company profile; Association news; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
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Sommario/riassunto |
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There is increasing customer demand for materials with low dissipation factors for reduced loss along the traces and low dielectric constants for higher signal propagation speeds. High performance epoxies such |
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as Nelco's N4000- 13, Isola's FR408 and General Electric's GETEK (similar to Matsushita's MEGTRON) have become essential for boards operating in the higher frequency range. For applications at the highest frequencies material choices are very limited. These materials, tailored for high frequency use, have disadvantages - either with their thermomechanical properties or with their process |
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