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Record Nr. |
UNINA9910742500403321 |
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Autore |
Yilmaz Murat |
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Titolo |
Systems, Software and Services Process Improvement : 30th European Conference, EuroSPI 2023, Grenoble, France, August 30 – September 1, 2023, Proceedings, Part I / / edited by Murat Yilmaz, Paul Clarke, Andreas Riel, Richard Messnarz |
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Pubbl/distr/stampa |
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Cham : , : Springer Nature Switzerland : , : Imprint : Springer, , 2023 |
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ISBN |
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Edizione |
[1st ed. 2023.] |
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Descrizione fisica |
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1 online resource (403 pages) |
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Collana |
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Communications in Computer and Information Science, , 1865-0937 ; ; 1890 |
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Altri autori (Persone) |
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ClarkePaul |
RielAndreas |
MessnarzRichard |
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Disciplina |
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Soggetti |
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Electronic data processing - Management |
Software engineering |
Application software |
Computer networks |
Computer systems |
Artificial intelligence |
IT Operations |
Software Engineering |
Computer and Information Systems Applications |
Computer Communication Networks |
Computer System Implementation |
Artificial Intelligence |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Nota di contenuto |
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SPI and Emerging and Multidisciplinary Approaches to Software Engineering -- Digitalisation of Industry, Infrastructure and E-Mobility -- SPI and Good/Bad SPI Practices in Improvement -- SPI and Functional Safety and Cybersecurity. |
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Sommario/riassunto |
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This two-volume set constitutes the refereed proceedings of the 30th European Conference on Systems, Software and Services Process |
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Improvement, EuroSPI 2023, held in Grenoble, France, in August-September 2023. The 47 full papers presented were carefully reviewed and selected from 100 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and agile; SPI and standards and safety and security norms; sustainability and life cycle challenges; SPI and recent innovations; virtual reality and augmented reality. . |
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