1.

Record Nr.

UNINA9910731473303321

Autore

Zou Shikun

Titolo

Laser Shock Peening : Fundamentals and Advances / / by Shikun Zou, Junfeng Wu, Ziwei Cao, Zhigang Che

Pubbl/distr/stampa

Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2023

ISBN

981-9911-17-6

Edizione

[1st ed. 2023.]

Descrizione fisica

1 online resource (398 pages)

Altri autori (Persone)

WuJunfeng

CaoZiwei

CheZhigang

Disciplina

671.7

Soggetti

Lasers

Materials—Fatigue

Aerospace engineering

Astronautics

Laser

Materials Fatigue

Aerospace Technology and Astronautics

Laser Technology

Laser-Matter Interaction

Lingua di pubblicazione

Inglese

Formato

Materiale a stampa

Livello bibliografico

Monografia

Nota di contenuto

Characteristics and current situation of laser shock peening -- Laser shock peening system for industrial application -- Process stability factors and safety protection of laser shock peening -- Numerical analysis of mechanical effect of laser shock peening -- Evaluations of strengthening effect of the metals with laser shock peening.

Sommario/riassunto

This book highlights the fundamentals and latest progresses in the research and applications of laser shock peening (LSP). As a novel technology for surface treatment, LSP greatly improves the resistance of metallic materials to fatigue and corrosion. The book presents the mechanisms, techniques, and applications of LSP in a systematic way. It discusses a series of new progresses in fatigue performance improvement of metal parts with LSP. It also introduces lasers,



equipment, and techniques of newly developed industry LSP, with a detailed description of the novel LSP blisk. The book demonstrates in details numerical analysis and simulation techniques and illustrates process stability control, quality control, and analysis determination techniques. It is a valuable reference for scientists, engineers, and students in the fields of laser science, materials science, astronautics, and aeronautics who seek to understand, develop, and optimize LSP processes.