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1. |
Record Nr. |
UNINA9910704201503321 |
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Titolo |
Taxation : foreign account tax compliance : agreement between the United States of America and Romania, signed at Bucharest, May 28, 2015, with annexes |
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Pubbl/distr/stampa |
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[Washington, D.C.] : , : United States Department of State, , [2015?] |
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Descrizione fisica |
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1 online resource (53 unnumbered pages) |
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Collana |
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Treaties and other international acts series ; ; 15-1103 |
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Soggetti |
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Foreign bank accounts - Law and legislation - Romania |
Foreign bank accounts - Law and legislation - United States |
Tax administration and procedure - International cooperation |
Treaties. |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Title from title screen (viewed on Feb. 19, 2016). |
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2. |
Record Nr. |
UNISA996574960003316 |
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Titolo |
1838-2019 - IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits / / Institute of Electrical and Electronics Engineers |
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Pubbl/distr/stampa |
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New York, New York : , : IEEE, , 2020 |
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ISBN |
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Descrizione fisica |
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1 online resource (73 pages) |
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Disciplina |
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Soggetti |
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Microwave transmission lines - Standards |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Sommario/riassunto |
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IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding. |
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