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1. |
Record Nr. |
UNINA9910817218403321 |
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Autore |
Liu Sheng |
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Titolo |
Modeling and Simulation for Microelectronic Packaging Assembly [[electronic resource] ] : Manufacturing, Reliability and Testing |
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Pubbl/distr/stampa |
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ISBN |
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1-299-31442-2 |
0-470-82782-3 |
0-470-82781-5 |
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Edizione |
[1st ed.] |
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Descrizione fisica |
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1 online resource (588 p.) |
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Classificazione |
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Altri autori (Persone) |
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Disciplina |
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Soggetti |
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Microelectronic packaging - Simulation methods |
Microelectronic packaging -- Simulation methods |
TECHNOLOGY & ENGINEERING / Electronics / Circuits / General |
Electrical & Computer Engineering |
Engineering & Applied Sciences |
Electrical Engineering |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di contenuto |
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing; Contents; Foreword by C. P. Wong; Foreword by Zhigang Suo; Preface; Acknowledgments; About the Authors; Part I: Mechanics and Modeling; 1 Constitutive Models and Finite Element Method; 1.1 Constitutive Models for Typical Materials; 1.1.1 Linear Elasticity; 1.1.2 Elastic-Visco-Plasticity; 1.2 Finite Element Method; 1.2.1 Basic Finite Element Equations; 1.2.2 Nonlinear Solution Methods; 1.2.3 Advanced Modeling Techniques in Finite Element Analysis |
1.2.4 Finite Element Applications in Semiconductor Packaging Modeling1.3 Chapter Summary; References; 2 Material and Structural Testing for Small Samples; 2.1 Material Testing for Solder Joints; 2.1.1 Specimens; 2.1.2 A Thermo-Mechanical Fatigue Tester; 2.1.3 Tensile Test; 2.1.4 Creep Test; 2.1.5 Fatigue Test; 2.2 Scale Effect of Packaging Materials; 2.2.1 Specimens; 2.2.2 Experimental Results and Discussions; 2.2.3 Thin Film Scale Dependence for Polymer Thin Films; |
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2.3 Two-Ball Joint Specimen Fatigue Testing; 2.4 Chapter Summary; References |
3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution3.1 Constitutive Model for Tin-Lead Solder Joint; 3.1.1 Model Formulation; 3.1.2 Determination of Material Constants; 3.1.3 Model Prediction; 3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills; 3.2.1 Constitutive Modeling of Underfills; 3.2.2 Identification of Material Constants; 3.2.3 Model Verification and Prediction; 3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys; 3.3.1 Damage Coupling Thermodynamic Framework |
3.3.2 Large Deformation Formulation3.3.3 Identification of the Material Parameters; 3.3.4 Creep Damage; 3.4 User-Supplied Subroutines for Solders Considering Damage Evolution; 3.4.1 Return-Mapping Algorithm and FEA Implementation; 3.4.2 Advanced Features of the Implementation; 3.4.3 Applications of the Methodology; 3.5 Chapter Summary; References; 4 Accelerated Fatigue Life Assessment Approaches for Solders in Packages; 4.1 Life Prediction Methodology; 4.1.1 Strain-Based Approach; 4.1.2 Energy-Based Approach; 4.1.3 Fracture Mechanics-Based Approach; 4.2 Accelerated Testing Methodology |
4.2.1 Failure Modes via Accelerated Testing Bounds4.2.2 Isothermal Fatigue via Thermal Fatigue; 4.3 Constitutive Modeling Methodology; 4.3.1 Separated Modeling via Unified Modeling; 4.3.2 Viscoplasticity with Damage Evolution; 4.4 Solder Joint Reliability via FEA; 4.4.1 Life Prediction of Ford Joint Specimen; 4.4.2 Accelerated Testing: Insights from Life Prediction; 4.4.3 Fatigue Life Prediction of a PQFP Package; 4.5 Life Prediction of Flip-Chip Packages; 4.5.1 Fatigue Life Prediction with and without Underfill |
4.5.2 Life Prediction of Flip-Chips without Underfill via Unified and Separated Constitutive Modeling |
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Sommario/riassunto |
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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming ""test and try out"" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people |
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2. |
Record Nr. |
UNINA9910576877403321 |
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Autore |
Lombraña José Ignacio |
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Titolo |
Environmental Friendly Catalysts for Energy and Pollution Control Applications |
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Pubbl/distr/stampa |
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MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
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Descrizione fisica |
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1 online resource (216 p.) |
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Soggetti |
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Environmental science, engineering and technology |
Technology: general issues |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Sommario/riassunto |
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Catalysts are widely used in a great variety of technologies, providing remarkable efficiency in order to address sustainable energy production, climate change challenges, and to reduce industrial emissions. In the framework of the Environmental Catalysis section promoted by the Catalysts Editorial Office, this Special Issue, entitled "Environmental Friendly Catalysts for Energy and Pollution Control Applications", comprises novel studies representing the state-of-the-art research for efficient energy generation and industrial emission control based on new environmentally friendly catalyst materials (EFCs). In particular, in this Special Issue (SI), different kinds of catalysts are presented for catalytic solutions, including the reduction of NOx emissions (new zeolite catalyst modified with Pt), the elimination of volatile organic compounds (Co3O4@SiO2 and acidic surface transformed natural zeolite) and the removal of SO2 emissions (through adsorption processes with sodium citrate). Moreover, novel biocatalysts for bioanodes and new functional nanostructured catalysts based on metal-organic framework (MOFs) for different applications are also included. Additionally, articles compiled in this SI are also focused on the improvement of catalytic processes. Thus, selected processes based on activated carbons (modified with titanium dioxide) and optimized Fenton processes for the removal of aqueous organic |
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pollutants or for the inactivation of bacteria are also presented. |
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