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Record Nr. |
UNINA9910551838003321 |
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Titolo |
Recent progress in lead-free solder technology : materials development, processing and performances / / edited by Mohd Arif Anuar Mohd Salleh [and three others] |
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Pubbl/distr/stampa |
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Cham, Switzerland : , : Springer, , [2022] |
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©2022 |
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ISBN |
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Descrizione fisica |
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1 online resource (332 pages) |
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Collana |
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Topics in Mining, Metallurgy and Materials Engineering. |
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Disciplina |
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Soggetti |
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Lead-free electronics manufacturing processes |
Metals |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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Intro -- Preface -- Acknowledgements -- Contents -- About the Editors -- Development of Materials -- Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder -- 1 Introduction -- 2 Materials Selection -- 2.1 Physical Properties -- 2.2 Mechanical Properties -- 2.3 Cost -- 3 Fabrication Technique -- 3.1 Casting -- 3.2 Powder Metallurgy -- 4 Characterisation -- 4.1 Microstructure and Properties of Ceramic Composite for Electronics -- 4.2 Electrical Properties -- 4.3 Mechanical Performance -- 5 Advantages and Limitation of Ceramics Composite Solder -- 6 Conclusion -- References -- Development of Geopolymer Ceramic-Reinforced Solder -- 1 Introduction -- 2 Geopolymer Materials -- 2.1 Fly Ash -- 2.2 Ground Granulated Blast Furnace Slag -- 2.3 Clay -- 2.4 Addition Mixture -- 3 Synthesis of Geopolymer Ceramics -- 3.1 Powder Metallurgy -- 3.2 Direct Sintering -- 3.3 Self-fluxing Agent of Low-Sintered Kaolin Geopolymer -- 4 Properties of Geopolymer Ceramic Particles for Solder Reinforcement -- 4.1 Geopolymer Ceramic -- 4.2 Geopolymer Ceramic with Polymer Addition -- 5 Application of Geopolymer Ceramic as a Reinforcement Particle in Lead-Free Solder -- 5.1 Composite Solder Fabrication -- 5.2 Properties of Solder Reinforced Geopolymer -- 6 Conclusion -- References -- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite |
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Solders -- 1 Introduction -- 2 Issues in Ceramic-Reinforced Composite Solder -- 2.1 Phase Segregation -- 2.2 Non-wetting and Non-uniform Distribution Properties of Reinforcement Particle -- 3 Type of Surface Modification Technique on the Reinforced Solder -- 3.1 Pyrolysis -- 3.2 Chemical Route -- 3.3 Electroless Plating -- 4 Effect of Surface Modification on the Reinforced Particle to the Solder Properties -- 4.1 Intermetallic Compound -- 4.2 Microstructure -- 4.3 Thermal Properties -- 4.4 Wettability. |
4.5 Mechanical Properties -- 5 Conclusion -- References -- Molecular Dynamic of the Nanoparticle Reinforcement in the Pb-Free Solder During Reflow Soldering Process -- 1 Introduction -- 2 Molecular Dynamics Approach -- 3 MD Simulation Setup -- 4 Solder Fabrication Techniques -- 5 Reflow Soldering Process -- 6 Results and Discussion -- 7 Conclusion -- References -- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics -- 1 Introduction -- 2 Transient Liquid Phase (TLP) Bonding Concepts -- 2.1 Solid-Liquid Interdiffusion (SLID) Bonding -- 2.2 TLP Bonding via Multiple Reflows Technique -- 2.3 TLP Bonding for Metal Powder -- 2.4 TLP Bonding in Metal Preform -- 3 Recent Studies on Transient Liquid Phase (TLP) Solders Systems -- 4 Challenges in Transient Liquid Phase (TLP) Solders Development -- 5 Conclusion -- References -- Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste -- 1 Introduction -- 2 Methodology -- 2.1 Preparation of the Miniaturized Package Assembly Using Nano-reinforced Lead-Free Solder -- 2.2 Characterization of the Nano-reinforced Lead-Free Solder Joint -- 3 Results and Discussion -- 3.1 Microstructure Investigation in the Miniaturized Solder Joint -- 3.2 Physical Integrity Analyses of Miniaturized Solder Joint -- 4 Conclusion -- References -- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi -- 1 Introduction -- 2 Bulk Solder Specimen Preparation: Sn-0.7Cu Solder Alloy Bearing Fe and Bi -- 3 Mechanical Properties -- 4 Microstructure Properties -- 5 Thermal Behavior -- 6 Wetting Angle and Spreading Rate -- 7 Oxidation Behavior -- 8 Corrosion Behavior -- 9 Electrical Properties -- 10 Conclusion -- References -- Processing and Performances -- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experimental. |
1 Introduction -- 2 Experimental Procedure -- 2.1 Simulation Analysis -- 2.2 Modeling for Steady-State Thermal Analysis -- 2.3 Sample Preparation -- 2.4 Isothermal Ageing Treatment -- 2.5 Characterization Analysis -- 3 Results and Discussion -- 3.1 Thermal Distribution, Total Deformation, and Equivalent Stress -- 3.2 Intermetallic Compounds Formation During Isothermal Ageing Treatment -- 4 Conclusion -- References -- Flux Modification for Wettability and Reliability Improvement in Solder Joints -- 1 Introduction -- 2 Overview of Flux for Soldering -- 2.1 Flux Reaction -- 2.2 Factors that Affect Flux Performance -- 2.3 Problems in Flux Soldering -- 3 Type of Flux Used in Soldering -- 4 Properties of Flux -- 5 Flux Modifications and Future Trends -- 6 Conclusion -- References -- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints -- 1 Introduction -- 1.1 Surface Finish Comparison and Specific Requirements -- 2 Electroless Nickel Immersion Gold (ENIG) -- 3 Immersion Tin (ImSn) -- 4 Immersion Silver (ImAg) -- 5 Organic Surface Protectant (OSP) -- 6 Controlling Intermetallic Compound (IMC) via Printed Circuit Board (PCB) Surface Finishes -- 7 Soldering Applications Using Surface Finishes -- 7.1 Surface Finish Applications -- 7.2 Surface Finish Reliability Testing -- 8 Summary -- References -- |
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Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of IMC Layer Thickness Measurements -- 1 Introduction -- 1.1 Significance of Intermetallic Compound Layer to the Reliability of Solder Joint -- 1.2 Intermetallic Compound (IMC) Layer Thickness Measurements -- 1.3 Stereometry Consideration on Intermetallic Compound (IMC) Layer Thickness Measurements -- 1.4 Summary -- References. |
The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth -- 1 Introduction -- 2 Type Laser Soldering and Its Characteristics -- 2.1 Carbon Dioxide (CO2) Laser -- 2.2 Nd:YAG Laser -- 2.3 Semiconductor Laser -- 3 The Intermetallic Compound (IMC) Formation and Growth -- 3.1 The Formation of IMC -- 3.2 Effect of Laser Soldering Parameters onto Interfacial Reaction at Solder Joint -- 4 Conclusion -- References -- Reliability Analysis on the Flexible Printed Circuit Board After Reflow Soldering -- 1 Introduction -- 2 Flexible Printed Circuit Board -- 3 Reflow Soldering of Flexible Printed Circuit Board -- 4 Defects During Soldering Process -- 5 Tensile Test of the Flexible Printed Circuit Board -- 6 Results and Discussion -- 7 Conclusion -- References -- Solder Paste's Rheology Data for Stencil Printing Numerical Investigations -- 1 Introduction -- 2 Numerical Simulation on Stencil Printing -- 3 Solder Paste Rheology -- 4 Solder Paste Viscosity Test -- 5 Solder Paste Rheology Measurement Using Rotary Rheometer -- 6 Non-newtonian Modelling for Solder Paste -- 6.1 Cross-Model Viscosity Model -- 6.2 Carreau-Yasuda Viscosity Model -- 6.3 Non-Newtonian Power Law Model -- 7 Conclusions -- References -- Tin Whiskers Growth in Electronic Assemblies -- 1 Introduction -- 2 Formation of Tin Whiskers -- 3 Results and Discussion -- 4 Measurement of Tin Whisker -- 5 Morphology of Tin Whisker -- 6 Factors of Tin Whiskers Formation -- 6.1 Tin Grain Structure -- 6.2 Intermetallic Compound Layers -- 6.3 Temperature and Humidity -- 6.4 Oxidation -- 7 Whisker Mitigation Practices -- 7.1 Underlayers -- 7.2 Annealing and Recrystallization -- 7.3 Use Matte Tin Finish -- 7.4 Substitution of Addictive in Solder Alloy -- 8 Conclusion -- References. |
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Sommario/riassunto |
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This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder. |
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