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1. |
Record Nr. |
UNINA9910456566903321 |
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Autore |
Zelner Kyle F |
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Titolo |
A rabble in arms [[electronic resource] ] : Massachusetts towns and militiamen during King Philip's War / / Kyle F. Zelner |
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Pubbl/distr/stampa |
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New York, : New York University Press, c2009 |
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ISBN |
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Descrizione fisica |
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1 online resource (342 p.) |
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Collana |
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The warfare and culture series |
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Disciplina |
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Soggetti |
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King Philip's War, 1675-1676 |
Impressment - History |
Electronic books. |
Essex County (Mass.) History 17th century |
New England History Colonial period, ca. 1600-1775 |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references (p. 297-311) and index. |
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Nota di contenuto |
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Frontmatter -- Contents -- List of Figures, Maps, and Tables -- Acknowledgments -- Introduction -- A Note on Method -- 1 “For the best ordering of the militia” -- 2 The Massachusetts Bay Militia and the Practice of Impressment during King Philip’s War -- 3 Many Men, Many Choices -- 4 Few Men, Few Options -- 5 The Pressed Men of Essex County -- 6 The Effects of Impressment -- Afterword -- Appendix 1 -- Appendix 2 -- Appendix 3 -- Appendix 4 -- Appendix 5 -- Abbreviations Used in the Notes -- Notes -- Selected Bibliography -- Permissions -- Index -- About the Author |
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Sommario/riassunto |
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While it lasted only sixteen months, King Philip’s War (1675-1676) was arguably one of the most significant of the colonial wars that wracked early America. As the first major military crisis to directly strike one of the Empire’s most important possessions: the Massachusetts Bay Colony, King Philip’s War marked the first time that Massachusetts had to mobilize mass numbers of ordinary, local men to fight. In this exhaustive social history and community study of Essex County, Massachusetts’s militia, Kyle F. Zelner boldly challenges traditional interpretations of who was called to serve during this period.Drawing on muster and pay lists as well as countless historical records, Zelner |
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demonstrates that Essex County’s more upstanding citizens were often spared from impressments, while the “rabble” — criminals, drunkards, the poor— were forced to join active fighting units, with town militia committees selecting soldiers who would be least missed should they die in action. Enhanced by illustrations and maps, A Rabble in Arms shows that, despite heroic illusions of a universal military obligation, town fathers, to damaging effects, often placed local and personal interests above colonial military concerns. |
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2. |
Record Nr. |
UNINA9910484726403321 |
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Titolo |
3D microelectronic packaging : from architectures to applications / / editors, Yan Li, Deepak Goyal |
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Pubbl/distr/stampa |
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Singapore : , : Springer, , [2021] |
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©2021 |
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ISBN |
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Edizione |
[2nd edition 2021.] |
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Descrizione fisica |
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1 online resource (XVII, 622 p. 299 illus., 205 illus. in color.) |
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Collana |
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Springer Series in Advanced Microelectronics, , 1437-0387 ; ; 64 |
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Disciplina |
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Soggetti |
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Biotechnology |
Electronics |
Electronics - Materials |
Microelectronics |
Microelectronics - Packaging |
Nanotechnology |
Electronic circuits |
Optical materials |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Nota di contenuto |
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1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu |
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bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging. |
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Sommario/riassunto |
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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. . |
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