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Record Nr. |
UNINA9910483152003321 |
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Titolo |
Micro-assembly technologies and applications : IFIP TC5 WG5. 5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France, February 10-13 2008 / / edited by Svetan Ratchev, Sandra Koelemeijer |
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Pubbl/distr/stampa |
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New York, NY : , : Springer, , [2008] |
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©2008 |
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ISBN |
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Edizione |
[1st ed. 2008.] |
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Descrizione fisica |
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1 online resource (427 p.) |
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Collana |
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IFIP International Federation for Information Processing ; ; 260 |
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Disciplina |
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Soggetti |
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Systems engineering |
Artificial intelligence |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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Design of Micro Products -- Application of a DF?A Methodology to facilitate the assembly of a Micro/Nano Measurement Device -- A DFA Framework for Hybrid Microsystems -- Statistical Assemblies with form Errors — A 2D Example -- A Classification and Coding System for Micro-Assembly -- A Method for Three Dimensional Tolerance Analysis and Synthesis Applied to Complex and Precise Assemblies -- New Designs for Submillimetric Press-Fitting -- Design and Testing of an Ortho-Planar Micro-Valve -- Robust Design of a Lens System of Variable Refraction Power with Respect to the Assembly Process -- Micro-Assembly Processes and Applications -- Product-Process Ontology for Managing Assembly Specific Knowledge Between Product Design and Assembly System Simulation -- Bridging the Gap — from Process Related Documentation to an Integrated Process and Application Knowledge Management in Micro Systems Technology -- Distributed Simulation in Manufacturing Using High Level Architecture -- Adaptive Packaging Solution for a Microlens Array Placed Over a Micro-UV-LED Array -- Solder Bumping — A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems -- Fluidassem - A New Method of Fluidic-Based Assembly with Surface Tension -- Concepts for Hybrid Micro Assembly Using Hot Melt Joining -- |
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