| |
|
|
|
|
|
|
|
|
1. |
Record Nr. |
UNINA9910465745503321 |
|
|
Autore |
Wells Louis T. |
|
|
Titolo |
Making foreign investment safe : property rights and national sovereignty / / Louis T. Wells, Rafiq Ahmed |
|
|
|
|
|
|
|
Pubbl/distr/stampa |
|
|
Oxford ; ; New York : , : Oxford University Press, , 2007 |
|
|
|
|
|
|
|
ISBN |
|
0-19-804243-4 |
1-4294-5946-8 |
9786610846849 |
1-280-84684-4 |
|
|
|
|
|
|
|
|
Descrizione fisica |
|
1 online resource (389 p.) |
|
|
|
|
|
|
Disciplina |
|
|
|
|
|
|
Soggetti |
|
Investments, Foreign - Indonesia |
Infrastructure (Economics) - Indonesia |
Government ownership - Indonesia |
Right of property - Indonesia |
Arbitration (International law) |
Electronic books. |
|
|
|
|
|
|
|
|
Lingua di pubblicazione |
|
|
|
|
|
|
Formato |
Materiale a stampa |
|
|
|
|
|
Livello bibliografico |
Monografia |
|
|
|
|
|
Note generali |
|
Description based upon print version of record. |
|
|
|
|
|
|
Nota di bibliografia |
|
Includes bibliographical references and index. |
|
|
|
|
|
|
Nota di contenuto |
|
State take-ove11119610r of infrastructure : 1967-1980 -- Indosat : foreign investment in a risky environment -- The Indosat deal -- Nationalization of Indosat -- The power of being needed -- Indosat : a successful state-owned firm -- Return of private ownership of infrastructure : electric power, 1990-1997 -- Back to private power -- Paiton's power : cost of poor preparation -- Paiton's power : a new contender -- Paiton's power : more home government support -- Evaluating Paiton I -- The new international property rights in action : 1997-2005 -- Paiton I : promises fail -- Paiton I : backing away from the new property rights -- Karaha Bodas Company : turning to arbitration -- CalEnergy : claiming official political risk insurance -- Enron : another kind of official insurance -- Nationality, corporate strategy, and the new property rights -- Revisiting privatization and the new international property rights system -- Reforming for development and profits. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Sommario/riassunto |
|
The 1980's & 90's brought new protections to foreign investors in risky countries. Yet, the assurances failed to meet investors needs & imposed sometimes inordinate costs on poor countries. This text contains case histories which suggest reforms for international arbitration & official investment insurance. |
|
|
|
|
|
|
|
|
2. |
Record Nr. |
UNINA9910137855403321 |
|
|
Autore |
Liu S (Sheng), <1963-> |
|
|
Titolo |
LED packaging for lighting applications [[electronic resource] ] : design, manufacturing, and testing / / Sheng Liu, Xiaobing Luo |
|
|
|
|
|
|
|
Pubbl/distr/stampa |
|
|
Hoboken, N.J., : Wiley, 2011 |
|
|
|
|
|
|
|
ISBN |
|
0-470-82840-4 |
1-283-20357-X |
9786613203571 |
0-470-82785-8 |
0-470-82784-X |
|
|
|
|
|
|
|
|
Descrizione fisica |
|
1 online resource (376 p.) |
|
|
|
|
|
|
Classificazione |
|
|
|
|
|
|
Altri autori (Persone) |
|
|
|
|
|
|
Disciplina |
|
|
|
|
|
|
Soggetti |
|
Light emitting diodes - Design and construction |
Light emitting diodes - Computer simulation |
Electronic packaging |
Electric lighting - Equipment and supplies |
|
|
|
|
|
|
|
|
Lingua di pubblicazione |
|
|
|
|
|
|
Formato |
Materiale a stampa |
|
|
|
|
|
Livello bibliografico |
Monografia |
|
|
|
|
|
Note generali |
|
Description based upon print version of record. |
|
|
|
|
|
|
Nota di bibliografia |
|
Includes bibliographical references and index. |
|
|
|
|
|
|
Nota di contenuto |
|
LED Packaging for Lighting Applications: Design, Manufacturing and Testing; Contents; Foreword By Magnus George Craford; Foreword By C. P. Wong; Foreword By B. J. Lee; Preface; Acknowledgments; About the Authors; 1 Introduction; 1.1 Historical Evolution of Lighting Technology; 1.2 Development of LEDs; 1.3 Basic Physics of LEDs; 1.3.1 Materials; 1.3.2 Electrical and Optical Properties; 1.3.3 Mechanical and Thermal Properties; 1.4 Industrial Chain of LED; 1.4.1 LED Upstream Industry; 1.4.2 LED Midstream Industry; 1.4.3 LED Downstream Industry; 1.5 Summary; References |
|
|
|
|
|
|
|
|
|
|
|
2 Fundamentals and Development Trends of High Power LED Packaging2.1 Brief Introduction to Electronic Packaging; 2.1.1 About Electronic Packaging and Its Evolution; 2.1.2 Wafer Level Packaging, More than Moore, and SiP; 2.2 LED Chips; 2.2.1 Current Spreading Efficiency; 2.2.2 Internal Quantum Efficiency; 2.2.3 High Light Extraction Efficiency; 2.3 Types and Functions of LED Packaging; 2.3.1 Low Power LED Packaging; 2.3.2 High Power LED Packaging; 2.4 Key Factors and System Design of High Power LED Packaging; 2.5 Development Trends and Roadmap; 2.5.1 Technology Needs; 2.5.2 Packaging Types |
2.6 SummaryReferences; 3 Optical Design of High Power LED Packaging Module; 3.1 Properties of LED Light; 3.1.1 Light Frequency and Wavelength; 3.1.2 Spectral Distribution; 3.1.3 Flux of Light; 3.1.4 Lumen Efficiency; 3.1.5 Luminous Intensity, Illuminance and Luminance; 3.1.6 Color Temperature, Correlated Color Temperature and Color Rendering Index; 3.1.7 White Light LED; 3.2 Key Components and Packaging Processes for Optical Design; 3.2.1 Chip Types and Bonding Process; 3.2.2 Phosphor Materials and Phosphor Coating Processes; 3.2.3 Lens and Molding Process; 3.3 Light Extraction |
3.4 Optical Modeling and Simulation3.4.1 Chip Modeling; 3.4.2 Phosphor Modeling; 3.5 Phosphor for White LED Packaging; 3.5.1 Phosphor Location for White LED Packaging; 3.5.2 Phosphor Thickness and Concentration for White LED Packaging; 3.5.3 Phosphor for Spatial Color Distribution; 3.6 Collaborative Design; 3.6.1 Co-design of Surface Micro-Structures of LED Chips and Packages; 3.6.2 Application Specific LED Packages; 3.7 Summary; References; 4 Thermal Management of High Power LED Packaging Module; 4.1 Basic Concepts of Heat Transfer; 4.1.1 Conduction Heat Transfer |
4.1.2 Convection Heat Transfer4.1.3 Thermal Radiation; 4.1.4 Thermal Resistance; 4.2 Thermal Resistance Analysis of Typical LED Packaging; 4.3 Various LED Packages for Decreasing Thermal Resistance; 4.3.1 Development of LED Packaging; 4.3.2 Thermal Resistance Decrease for LED Packaging; 4.3.3 SiP/COB LED Chip Packaging Process; 4.4 Summary; References; 5 Reliability Engineering of High Power LED Packaging; 5.1 Concept of Design for Reliability (DfR) and Reliability Engineering; 5.1.1 Fundamentals of Reliability; 5.1.2 Life Distribution; 5.1.3 Accelerated Models; 5.1.4 Applied Mechanics |
5.2 High Power LED Packaging Reliability Test |
|
|
|
|
|
|
Sommario/riassunto |
|
"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"-- |
|
|
|
|
|
|
|
| |