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Record Nr. |
UNINA9910462897303321 |
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Autore |
Wang Guoan |
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Titolo |
Passive RF Component Technology : Materials, Techniques, and Applications |
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Pubbl/distr/stampa |
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Norwood : , : Artech House, , 2012 |
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[Piscataqay, New Jersey] : , : IEEE Xplore, , [2011] |
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ISBN |
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Descrizione fisica |
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1 online resource (305 p.) |
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Collana |
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Artech House microwave library |
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Altri autori (Persone) |
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Disciplina |
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Soggetti |
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Passive components |
Radio circuits |
Wireless communication systems |
Electronic books. |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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Passive RF Component Technology Materials, Techniques, and Applications; List of Contributors; Contents; Chapter 1 Introduction; Chapter 2 Overview of RF Passives and Enabling Materials; 2.1 Passive Filters; 2.2 Combiners, Dividers, Hybrids, and Couplers; 2.3 Inductors, Transformers, and Baluns; 2.4 Antennas; 2.5 Summary; References; Chapter 3 Novel Flexible Material Liquid Crystal Polymer (LCP) Based Flexible Passives; 3.1 Introduction; 3.2 LCP Properties; 3.3 Multilayer LCP Process Development; 3.4 Design and Fabrication of LCP-based Tunable RF Passives; 3.4.1 Filters. |
3.4.2 Monolithically Integrated RF MEMS3.4.3 Phase Shifters; 3.4.4 Antennas; 3.4.5 Antenna Arrays; 3.5 LCP for 3D Integration and Packaging; 3.6 Summary; References; Chapter 4 Ferroelectric-based Tunable RF Capacitor; 4.1 Introduction; 4.2 BST Materials for RF Capacitors; 4.2.1 Structure and Properties; 4.2.2 Thin-film Tunable Capacitors; 4.3 Ferroelectric Capacitor with Low Tuning Voltage and High Linearity; 4.3.1 Architecture for Reduced Intermodulation Distortion in Ferroelectric RF Tunable Capacitors; 4.3.2 Analysis of the Capacitor with Low Tuning Voltage and High Linearity. |
4.3.3 Device Implementation4.3.4 Characterization; 4.4 Low Conductor |
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Loss Capacitor; 4.4.1 Low-loss Microelectrodes Fabricated Using Reverse-side Exposure; 4.4.2 Characterization of Low Conductor Loss Capacitors; 4.5 Embedded Ferroelectric Capacitor; 4.5.1 Multi-interdigitated BST Gap Capacitor; 4.6 Summary; 4.7 Future Prospects; References; Chapter 5 High Aspect Ratio RF Passives Enabled by Smart RF Materials and Polymer-core Conductor Micromachining Technologies; 5.1 Introduction; 5.1.1 Importance of the High-performance Passives with High-quality Factors. |
5.1.2 Existing Approaches to Improve Performances of Millimeter Passives5.2 Properties of SU-8 Polymer; 5.3 The Introduction of Polymer-core Conductor Micromachining Technology; 5.3.1 Fabrication Flow; 5.3.2 Advantages of the Polymer-core Conductor Technology; 5.4 High-Q RF Inductors by This Approach; 5.5 High-performance Millimeter-wave Antennas Using the Polymer-core Conductor Approach; 5.5.1 A Millimeter-wave Monopole Antenna; 5.5.2 An Elevated Patch Antenna; 5.5.3 A Surface Micromachined Horn Antenna Using a Polymer-core Conductor. |
5.6 High-aspect-ratio Micromachined Filters, Duplexer, and Coupler5.6.1 Micromachined Cavity Resonator; 5.6.2 SU-8-based Cavity Filters for 60-GHz Applications; 5.6.3 SU-8-based Surface Micromachined Cavity Duplexer; 5.6.4 SU-8-based Surface Micromachined Microstrip Edge Coupler; 5.7 Summary; References; Chapter 6 CNT-based Passive Circuits and Detectable Components; 6.1 Introduction; 6.2 CNT-based Transmission Line and Interconnect; 6.2.1 CNT-based Transmission Line; 6.2.2 CNT-based Interconnects; 6.3 CNT-based Flexible and Pattern-agile Antennas; 6.3.1 CNT-based Flexible Antenna. |
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Sommario/riassunto |
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Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-bas. |
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