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1. |
Record Nr. |
UNINA9910462521303321 |
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Titolo |
Powder technology and application II : selected, peer reviewed papers from the 2009 International Powder Technology & Application Forum / / edited by Yuexin Han |
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Pubbl/distr/stampa |
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Stafa-Zurich, Switzerland ; ; Enfield, New Hampshire : , : Trans Tech Publications, , [2010] |
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©2010 |
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ISBN |
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Descrizione fisica |
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1 online resource (282 p.) |
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Collana |
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Advanced materials research, , 1022-6680 ; ; volume 92 |
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Altri autori (Persone) |
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Disciplina |
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Soggetti |
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Powders |
Powder metallurgy |
Nanoparticles |
Electronic books. |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and indexes. |
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Nota di contenuto |
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Powder Technology and Application II; Preface; Table of Contents; A Facile Reaction for the Preparation of BN Nanospheres; A Novel Method for Preparation of Carbon Coating Iron Nanoparticles; A Novel Combined Flowsheet of Beneficiation and Acid Leaching under High Pressure for Complex Lead-Zinc Ores; Application of Au Nanoparticles-AgCl@Polypyrrole Hybrid Material to Amperometric Biosensor; Attempt to Synthesize Carbon Nanotube by a Thermal Reduction of Ether ; Cubic-Shaped Nano-MgO Powder and its Infrared Absorption Properties; Combustion Synthesis of Si3N4/MoSi2 Composite |
Controlling Mechanism of Soluble Phosphates during CaCO3 Whiskers SynthesisCo-Precipitation Synthesis and Optimization Process for LiCo1/3Ni1/3Mn1/3O2; Crystallization Behavior and Performance of MgO-Al2O3-SiO2 Glass-Ceramics by Sintering; Dispersion and Behavior of Silane Coupling Agent to Surface Modification of n-Cu Particles; Effect of Crystal Contolling Agents on Shapes of Nanometer Calcium Carbonate; Experimental Study on Developing White Carbon Black by Using Wollastonite; Flotation and Purification Research on Low Grade Magnesite in Kuandian of Liaoning |
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Floatation Separation Research on Siderite-Containing Iron ConcentrateFundamental Research in Comprehensive Utilization of Bayan Obo Ore by Direct Reduction; Large Scale Synthesis of Shuttle like CuO Nanocrystals by Microwave Irradiation; Hydrothermal Synthesis of Luminescent Wollastonite-CePO4 Nanocomposites; MgO-Al2O3-SiO2 Glass-Ceramic Prepared by Sol-Gel Method; Microwave-Assisted Controlled Synthesis of CaCO3 with Various Biomimetic Morphologies Using Basic Additives in Polyol; Physicochemical Characterization of Qianghuo Particles by Ultrafine Pulverization |
Preparation and Electrochemical Properties of LiFePO4/PPy Composite Cathode Materials for Lithium-Ion BatteriesPreparation and Particle Size Characterization of Cu Nanoparticles Prepared by Anodic Arc Plasma; Preparation of Carbon Materials with Different Morphologies; Preparation of Liposome Particle of Atractylone by Supercritical Carbon Dioxide Process; Preparation of Silica Abrasives from Water Glass and Application in Silicon Wafer Polishing; Preparation of Y2O3 Nano-Phased Powders by Polyacrylamide Gel Method ; Preparation of Zinc-Flake by High Energy Milling |
Relationship of Particle Content and Size of Spherical Silica with the Flowability of Epoxy Molding Compounds for Large-Scale Integrated Circuits PackagingResearch of Improving Water Injection Effect by Using Active SiO2 Nano-Powder in the Low-Permeability Oilfield; Research on Fuxin Plant Coal Ash as a Fluoride-Containing Wastewater and Mechanism of Fluoride Removal; Study on Size Distribution of the Copper and Nickel Ore; Study on the Surface Modification of Nanometer Calcium Carbonate; Study on the Synthesis of High Quality Nanometer Calcium Carbonate Using Ultrasonic Technology |
Study of Mechanical Properties of Magnesium Oxysulfate Whisker/ABS Composites |
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Sommario/riassunto |
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The theme of this special collection of peer-reviewed papers is the preparation and application of High-Performance Mineral-based Powders (HQMP). Here, HQMP refers to powder prepared from natural minerals with high specifications. It is predicted that the area of application of HQMP will become increasingly extensive. The future development of HQMP lies in the further exploitation and improvement of the manufacturing and production technologies of HQMP-orientated towards markets, and this collection will provide a handy roadmap for these likely developments. |
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2. |
Record Nr. |
UNINA9910450385003321 |
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Titolo |
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu |
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Pubbl/distr/stampa |
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Bradford, England, : Emerald Group Publishing, c2006 |
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ISBN |
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1-280-54757-X |
9786610547579 |
1-84663-011-8 |
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Descrizione fisica |
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1 online resource (72 p.) |
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Collana |
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Soldering & surface mount technology ; ; v.18, no. 2 |
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Altri autori (Persone) |
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BaileyChristopher |
LiuJohan |
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Disciplina |
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Soggetti |
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Manufacturing processes |
Electronic packaging |
Electronic books. |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di contenuto |
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Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder |
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
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Sommario/riassunto |
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This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together |
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scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i |
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