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Record Nr. |
UNINA9910461456403321 |
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Titolo |
Lithography [[electronic resource] ] : principles, processes and materials / / Theodore C. Hennessy, editor |
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Pubbl/distr/stampa |
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New York, : Nova Science, c2011 |
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ISBN |
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Descrizione fisica |
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1 online resource (299 p.) |
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Collana |
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Engineering tools, techniques and tables |
Nanotechnology science and technology |
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Altri autori (Persone) |
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Disciplina |
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Soggetti |
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Microlithography |
Microfabrication |
Electronic books. |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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""LITHOGRAPHY:PRINCIPLES, PROCESSES AND MATERIALS""; ""CONTENTS""; ""PREFACE""; ""PRINCIPLE, PROCESSES AND MATERIALS FOR NANO IMPRINT LITHOGRAPHY""; ""1. INTRODUCTION""; ""2. PRINCIPLE AND FUNDAMENTAL PROCESS FOR NIL""; ""2.1. Principle of NIL""; ""2.2. Theoretical Analysis for NIL""; ""2.3. Fundamental Process for NIL""; ""3. VARIATIONS OF NIL PROCESSES""; ""3.1. Combined Thermal and UV-NIL""; ""3.2. Reverse Imprint Process""; ""3.3. Laser-Assisted Direct Imprint""; ""3.4. Roll Imprint Process""; ""3.5. Substrate Conformal Imprint Lithography (SCIL)""; ""3.6. Large Area Imprint"" |
""3.7. Nanoelectrode Lithography""""3.8. Hybrid NIL Process""; ""3.9. Metal Nanoparticle Nanoimprinting Process""; ""3.10. High Resolution NIL""; ""3.11. Other NIL Processes""; ""4. NIL MATERIALS""; ""4.1. NIL Resists""; ""4.2. Functional Materials and Other Imprintable Materials""; ""4.3. Mold Materials""; ""5. PROSPECTS AND CHALLENGES IN NIL""; ""6. CONCLUSION""; ""ACKNOWLEDGMENTS""; ""REFERENCES""; ""NANOFABRICATION IN ELECTRONBEAM LITHOGRAPHY""; ""1. ELECTRON BEAM LITHOGRAPHY OVERVIEW""; ""1.1. Introduction to the Electron Beam Lithography System""; ""1.2. Proximity Effect"" |
""1.3. Numerical Calculation of the E-beam (Monte Carlo Method)""""2. CARBON NANOTUBE (CNT) BASED DEVICES""; ""2.1.Introduction to carbon nanotubes ""; ""2.2. VACNT Based FE Device with Individual |
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